high thermal conductivity potting compound Manufacturers

Achieve robust, reliable PCB assemblies with our specialized white paste adhesive. Key advantages: Non-Sag Formula for vertical application ease, Excellent Waterproofing & Shock Resistance protecting sensitive electronics, and Easy Dispensing paste consistency. Ideal for securing connectors, transformers, and larger SMDs. Free samples available!

TS8800 Economic 1:1 Two-Component Silicone Potting Compound, specially developed for LED drivers and power modules, offers both thermal conductivity and waterproofing. It cures at room temperature, is easy to mix, requires no special equipment, and is suitable for both automated and manual operations. After curing, it is flexible and crack-resistant, effectively protecting electronic components from moisture and dust. It offers excellent value for money, supports bulk purchases at wholesale prices, meets the stable protection needs of mid-to-low-end products, free samples are available upon request, and factory direct supply ensures fast delivery.

TS8866 potting compound with 1.0 W/m・K high thermal conductivity, 1:1 two-component ratio, suitable for power converters, PCB boards, and LED driver packaging. It cures quickly at room temperature, has excellent flowability, and can fully fill tiny gaps to form a seamless protective layer. After curing, it is resistant to high and low temperatures and thermal shock, with stable thermal conductivity, accelerating heat dissipation and improving equipment stability; it is also waterproof and flame retardant, ensuring safe use. Free samples are available; direct factory sales for bulk orders, with preferential pricing for large quantities.

Our 2.0W/mK thermal paste is easy to apply—perfect for GPUs & PCB boards. It has a smooth, non-runny texture, fills micro-gaps quickly, and boosts heat transfer for mid-range components. Ideal for DIY builds or professional maintenance.

SMT Red Adhesive Glue for Stencil Printing Heat Curing Features & Benefits Tensan SMT red glue is a one-component epoxy adhesive, curing at high temperature. It is designed for SMD components on printed circuit board bonding. 4109A has suitable for high-speed SMT placement machine Dispensing and stencil printing. It is of high adhesive strength after curing . REACH, ROHS, certified Excellent thixotropy Good adhesive strength after curing Easy to mix and use

Designed for power supplies and LED devices, TS9911 black silicone potting compound combines concealment with performance. The compound’s waterproof insulation safeguards against environmental damage, and the 10:1 mix ratio simplifies assembly lines. Curing into a tough yet flexible material, it resists vibration and mechanical stress, making it perfect for long-term use in industrial electronics.