Power module potting generally mainly
includes: thermally conductive potting glue, epoxy resin glue potting glue, silicone potting glue, polyurethane potting glue and so on.
The silicone-based electronic potting
compound has become the first choice for the potting compound base due to its
excellent physical and chemical properties and process performance, although
the thermal conductivity of the silicone-based potting compound itself is not
high, 0.17W/m. K, but as long as the high thermal conductivity filler is added,
its thermal conductivity can be improved. At present, the thermal conductivity
of silicone potting compounds on the market has reached 0.5~4.5 W/m. K after
modification.
Electronic potting glue generally needs to
have the following properties:
1. Low viscosity, good leveling, suitable
for molding complex electronic parts.
2. After curing, it forms a soft rubbery
shape with good impact resistance.
3. Excellent heat resistance, moisture
resistance and cold resistance, which can prolong the life of electronic
accessories after application.
4. Addition type, can be cured at room temperature
and heated
5. Has excellent moisture-proof and
waterproof effect.
TENSAN TS8833 white gray two-component
silicone thermal conductive encapsulant
TENSAN TS8833 white and gray two-component
silicone thermal conductive encapsulant can be used for adapters, transformers,
ballasts, sensors, electrical control units, etc.
◆ Two-component addition silicone rubber
◆ 1:1 mixing ratio
◆ Low curing shrinkage
◆ Excellent high temperature electrical
insulation and stability
◆ Good waterproof and moisture resistance
