There are many electronic sealants on the market, which can be divided into a single component and double component according to the composition. The difference between them is that the single component can be cured directly without adding any supporting products. The two-component curing agent should be added in proportion to cure.
Single component heat conduction sealant
Single-component heat conduction potting adhesive belongs to room-temperature curing machine potting adhesive. Single-component electronic heat conduction potting adhesive is made of imported organic silicon as the main raw material and other component materials. It channeled through a condensation reaction with moisture in the air caused by low molecular cross-linking, and high sulfide into a single body, completely cured, excellent resistance to high and low-temperature performance change, will have contact 鏠 after element fixed gap and reduce the cooling effect.
The single-component thermal conductive sealant has excellent thermal conductivity and heat dissipation performance, as well as superior electrical properties, such as anti-aging, anti-cold, and heat alternating performance, moisture-proof, non-swelling, absolute green performance, power decay rate, shockproof, waterproof, vibration absorption, and stability, which increase the safety factor of electronic products in the process of use. Excellent bonding strength for electronic components, PVC, plastics, etc., and excellent sealing and thermal conductivity.
At the same time, the single-component filling sealant is easy to operate and can be applied manually or mechanically, without leakage, which can meet a variety of working environments and working conditions, and has the performance of easy and convenient sizing. The single-component heat-conducting sealant is a non-toxic and pollution-free product, which is safer and environmentally friendly and has passed THE European RoHS standard.
Two-component heat conduction sealant
The two-component thermal conductive potting sealant can be used as a heat transfer medium for cooling of electronic components. It can solidify into soft elastomer in situ without stress on electronic components. After curing, it is closely glued to the contact surface to reduce heat resistance, which is more conducive to heat transfer between the heat source and its surrounding fins, motherboards, metal shells, and shells.
The two-component thermal conduction potting adhesive has the advantages of high thermal conductivity, good insulation performance, and ease to use. It can be widely used in the packaging of integrated circuits, integrated chips, converters, and other power modules, semiconductors, relays, rectifiers, and transformers. At the same time, the two-component thermal conductive sealant has good high and low-temperature resistance, excellent weather resistance, radiation resistance, excellent dielectric, chemical and mechanical properties stability, more effective protection of electrical components.
The difference between single-component and two-component heat-conducting potting sealant
Single-component thermal conductive adhesive is widely used for bonding and sealing between PTC sheet and aluminum heat sink, as well as coating and fixing of sensor surface plug-in wire or sheet due to its strong adhesion to the metal surface and difficulty in spalling. It is mainly used in the heat dissipation of CPU radiator, the heat dissipation between crystal tube, wafer and heat sink, heat conduction glue for the electric iron bottom plate, heat conduction of transformer and electronic components fixing and filling. After curing, the two-component heat-conducting potting sealant can be easily removed from the electronic components due to its elasticity, which ensures that the electrical appliances can be repaired and more environmentally friendly.