The biggest difference between them is that the condensed version produces small molecules, while the additive version does not, and this determines the difference in their performance. Thermal pouring sealant and molding pouring sealant has also been a potting waterproof a difficult problem, at the same time easy to poisoning (curing glue not dry or slow) curing, curing agent and chemical compounds such as S, P, N is very easy to reach, in spite of this, the advantages of organic silicon and molding pouring sealant too obvious, gel strength, no corrosion, no shrinkage, good electric insulation performance.