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The difference between one and two-component thermal potting


The difference between one-component and two-component is that the one-component can be directly cured without adding any supporting products. The two-component type requires the addition of a curing agent in proportion to cure.

One-component thermal conductive potting glue belongs to room temperature curing organic potting glue, one-component electronic thermal conductive potting glue is refined from imported silicone as the main raw material and other ingredients. It releases low molecules through a condensation reaction with moisture in the air to cause cross-linking and vulcanizes into a high-performance monomer. After complete curing, it has excellent resistance to high and low-temperature changes, and will not be caused by contact gaps after the components are fixed. Reduce heat dissipation.

The one-component thermally conductive potting compound has excellent thermal conductivity and heat dissipation performance, as well as excellent electrical properties, aging resistance, anti-cold and heat alternating performance,moisture resistance and non-swelling, electrical insulation green performance, power decay rate, shock resistance, waterproof, Vibration absorption and stability increase the safety factor of electronic products during use. It has excellent bonding strength to electronic components, PVC, plastics, etc., as well as excellent sealing and thermal conductivity.

  • Two-component thermally conductive potting compound.

The two-component thermally conductive potting compound is used as a heat transfer medium for cooling electronic devices and can be cured in situ into a soft elastomer without stress to electronic components. After curing, it is closely attached to its contact surface to reduce thermal resistance, which is more conducive to the heat conduction between the heat source and its surrounding heat sinks, motherboards, metal shells, and shells.

The two-component thermally conductive potting compound has the advantages of high thermal conductivity, good insulation performance, and easy use. It can be widely used in the packaging of integrated circuits, integrated chips, converters, and other power modules, semiconductors, relays, rectifiers, and transformers. At the same time, the two-component thermally conductive potting compound has good high and low-temperature resistance, excellent weather resistance, radiation resistance, excellent dielectric properties, stable chemical properties, and mechanical properties, and can protect electrical components more effectively.

  • The difference between the one-component thermally conductive encapsulant and two-component thermally conductive encapsulant.

One-component thermal adhesive is widely used for bonding and sealing of PTC sheet and aluminum heat sink, as well as coating and fixing of plug-in wires or sheets on the sensor surface because the glue has strong adhesion to the metal surface and is not easy to peel off. Mainly used in CPU radiator, heat dissipation between transistors, wafers, and heat sinks, thermal paste for heat dissipation of electric iron soleplates, heat conduction of transformers, and fixing of electronic components, followed by filling. After curing, the two-component thermal conductive encapsulant can be easily peeled off from electronic components because of its elasticity, ensuring that electrical appliances can be repaired and more environmentally.

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