Industry dynamic

The difference between thermally conductive potting encapsulant and thermally grease


1. What are the characteristics of thermally conductive potting encapsulant?

Thermally conductive potting encapsulant is a low-viscosity, flame-retardant, two-component, silicone thermally conductive potting encapsulant, which can be cured at room temperature or by heating. The higher the temperature, the faster the curing. The biggest difference with thermal grease is that thermally conductive potting encapsulant can be cured and has a certain bonding performance.Thermally conductive potting encapsulant is a kind of silicone rubber, which is a single-component room temperature vulcanized liquid rubber.Once exposed to the air, the silane monomers in it will condense to form a network structure, the system is cross-linked, can not melt and dissolve, is elastic, becomes rubbery, and bonds objects. Its thermal conductivity is slightly higher than general rubber, but much lower than thermal conductive silicone grease, and once cured, it is difficult to separate the bonded objects.

2. What are the characteristics of thermal grease?

Thermal grease is a kind of high thermal conductivity insulating organic silicon material. It is not cured and can be used for a long time at a temperature of -50 ℃-+230 ℃ to maintain the state of grease when used. It not only has excellent electrical insulation, but also has excellent thermal conductivity, and at the same time has low oil separation (towards zero), high and low temperature resistance, water resistance, ozone resistance, and weathering resistance. It can be widely applied to the contact surface between the heating element (power tube, thyristor, electric heating pile, etc.) and heat dissipation facilities (heat sink, heat sink, shell, etc.) in various electronic products and electrical equipment. The role of heat transfer media and the performance of moisture-proof, dust-proof, anti-corrosion and shock-proof. It is suitable for surface coating or integral potting of various microwave devices such as microwave communications, microwave transmission equipment, microwave special power supplies, regulated power supplies, etc. This type of silicon material provides excellent thermal conductivity for electronic components that generate heat. Such as: transistors, CPU assembly, thermistors, temperature sensors, automotive electronic parts, automotive refrigerators, power modules, printer heads, etc.

We use cookies to offer you a better browsing experience, analyze site traffic and personalize content. By using this site, you agree to our use of cookies. Privacy Policy
Reject Accept