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What's the difference between thermal paste, grease, and pads


A growing trend in applications is the mounting of heat sinks for LED chips. Current power LEDs are power consuming 500 milliwatts per unit,of which only 20% of the energy is converted to visible light. The larger portion of the energy must be radiated or dissipated to keep the temperature of the electronics below 120°C.When the temperature rises, the light yield and service life of the lamp will be reduced.

The advantage of thermally conductive adhesives for mounting LED chip heat sinks is that they provide mechanical and thermal performance over the entire area of the bond, so that heat dissipation is very effective. The maximum temperature is about 66°C. For every 1°C increase in operating temperature, the service life is significantly reduced.

However, some thermal substances are different. For example, alumina can be burned in a safe. Don't put alumina on your processor. What do you do with alumina?What about the insulation? The insulation layer is different. They are easier to install, but not as effective as a thin layer of hot paste (or grease, etc.). Some CPU coolers in stock have backplanes because they are good, clean and working properly. However, if you install your own CPU cooler,

I still recommend using thermal bonding (or bonding, etc.).Thermal adhesives are also different. Technically, your dough and grease are adhesives, but not thermal adhesives (or "epoxy"). If something has a thermal label on it, don't use it on your processor! Your CPU cooler is tight, so you don't need strong adhesive. Anything bonded with a hot melt adhesive will stick together, so use it only if you're sure you know what you're doing, perhaps with a custom GPU coolant.Most of the time, you only need a little hot mucus (or fat, etc.). Whatever its name, it's just a variation of the same thing: "thermal interface compound".

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