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Applications of epoxy resins

Epoxy resins, abbreviated EP, are relatively new thermosetting resins, which are polymers containing more than two epoxy groups in one molecule. It also includes polymer components that are generated from non-closed hydroxyl rings. Many types exist, depending on various complex combinations. With a specific gravity of approximately 1.8 and a heat resistance of 260°C, they are abrasion and chemical resistant and have excellent electrical insulation properties.

The epoxy group hardens under the action of the stiffening agent while generating hydroxyl groups, resulting in a surprisingly strong adhesion, a masterpiece of bonding agents. They are used for bonding metal, ceramics, wood, leather and almost all plastics. As a bonding agent for metals, it is particularly effective and is known as a structural bonding agent. As a coating, the film is impermeable to water and air and has a high degree of adhesion, which is an important application. As a base material for fibre-reinforced resins, it can be moulded at normal temperature and pressure, like polyesters, and can perform even better than polyesters. Like unsaturated polyesters, it has a wide range of applications, but is utilised for more advanced uses.

Due to their excellent physical properties when cured and their ease of handling, epoxy resins have been used in a variety of industrial applications such as adhesives, casting, encapsulation, laminating, moulding, coating and insulation. Epoxy resins are usually classified as liquid (where the epoxy resin is liquid at room temperature), and solid (where the epoxy resin is solid at room temperature). Generally, during storage and transport, this solid type of epoxy resin is contained in an envelope type container in powder or flake form. Due to their low molecular weight, solid epoxy resins are susceptible to a phenomenon known as "caking" during storage and transport. Lumping is a phenomenon whereby the particles of the epoxy resin fuse and bond. Caking causes serious handling problems: it is difficult to remove the resin from the container and to put it into another container for use.

In recent years, there has been a tendency to use solid epoxy resins with further lower molecular weights in applications where solid epoxy resins are applied, such as powder coatings or encapsulants for semiconductors,in order to achieve improved flow during moulding. As a result, the above-mentioned agglomeration problems become more acute. As a result, epoxy resins are usually stored and transported at cooler temperatures in order to prevent caking, but this has the problem of making them more costly.Tensan provides a granular epoxy resin, a method for its production and a packaging part thereof. The epoxy resin exhibits excellent flow during moulding due to its low melt viscosity and is easy to handle as it is difficult to cause agglomeration during storage and transport. 

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