In recent years, there has been a tendency to use solid epoxy resins with further lower molecular weights in applications where solid epoxy resins are applied, such as powder coatings or encapsulants for semiconductors,in order to achieve improved flow during moulding. As a result, the above-mentioned agglomeration problems become more acute. As a result, epoxy resins are usually stored and transported at cooler temperatures in order to prevent caking, but this has the problem of making them more costly.Tensan provides a granular epoxy resin, a method for its production and a packaging part thereof. The epoxy resin exhibits excellent flow during moulding due to its low melt viscosity and is easy to handle as it is difficult to cause agglomeration during storage and transport.
