Tensan thermal gel is a prominent player in the thermal conductive market. It features a high thermal conductivity coefficient, ensuring rapid heat transfer and better cooling than many alternatives. The curing process is flexible, yielding a stable and elastic gel post-curing, in contrast to some gels with strict curing demands. It exhibits excellent chemical and thermal stability over the long term, while some others falter in extreme conditions. The syringe packaging and automatic dispensing method allow for precise and efficient application, suitable for automated production lines, unlike traditional construction of certain gels. Environmentally friendly, it lacks harmful substances. Despite a mid-to-high price range, its superior performance and quality make it an ideal choice for electronics requiring efficient heat dissipation.
Tensan coating adhesive is a remarkable material. It shows outstanding bonding performance, firmly adhering to diverse materials like metals, plastics, and glass. The curing process is favorable, with a proper speed and less strict environmental demands compared to some adhesives. Its temperature resistance is broad, remaining stable from low to high temperatures. The insulation property is excellent, safeguarding electronic components. Chemically, it withstands various substances well. Environmentally, it contains no harmful elements like heavy metals and halogens. Overall, Tensan coating adhesive outperforms many others in multiple aspects, providing a reliable option for coating applications, though specific usage still requires considering actual working conditions.
Tensan thermal pads have outstanding performance in multiple aspects. In thermal conductivity, advanced technology enables efficient heat transfer, far better than ordinary pads. It has excellent insulation performance, preventing leakage and short circuits, while some ordinary pads have potential risks. It has a wide temperature resistance range and remains stable at high temperatures, while ordinary pads are prone to aging and failure. With good flexibility, it can closely fit heat dissipation surfaces, while ordinary pads may have poor contact. Its compression and rebound performance is excellent, maintaining well after multiple compressions, while ordinary pads have a rapid decrease in rebound rate. Although Tensan thermal pads have obvious advantages, the actual selection still needs to be comprehensively considered according to equipment and working conditions, providing an important reference for material selection in the heat dissipation field.
Tensan UV adhesive shows remarkable performance. It cures rapidly, taking only 5 - 10 seconds under specific conditions, far exceeding ordinary UV adhesives. It has high bonding strength, with a tensile shear strength of over 20MPa for various materials, while common adhesives are around 10 - 15MPa. It has strong weather resistance, with minimal performance degradation after 1,000 hours of testing, unlike ordinary adhesives that are prone to aging and yellowing. It has good flexibility, and its special structure can buffer stress, differing from brittle adhesives. It has excellent transparency, with a visible light transmittance of over 95%, higher than ordinary adhesives with impurities and bubbles. It has good environmental protection, without formaldehyde, benzene and other VOCs, and no harmful gas emission during curing. Some ordinary adhesives contain harmful substances and release VOCs. It has significant application advantages in many industries.
This report centers on the comparison between Tensan Red Glue and other red glues. Tensan Red Glue shows superiority in performance. It has excellent viscosity, rapid curing with good heat and chemical resistance, precise glue dot control, favorable cleaning property and high reliability. In contrast, other glues have drawbacks like unstable viscosity and weak resistance in harsh conditions. Regarding cost-effectiveness, Tensan Red Glue boosts production efficiency and cuts waste. In application, it suits consumer electronics, automotive electronics and industrial control where high performance and reliability are essential, while others are restricted in such fields. Enterprises should consider multiple factors for glue selection.
This article deeply compares Tensan silicone potting with other common silicone potting. In terms of basic properties, Tensan silicone potting has a moderate and stable viscosity, a relatively fast and balanced curing time. In environmental resistance properties, it can resist heat up to 200°C, cold down to -45°C, and also has good moisture and chemical corrosion resistance. In electrical properties, it shows excellent insulation and a stable and suitable dielectric constant. It has good adhesion to substrates and long-term stability. In environmental protection and safety, it complies with environmental protection standards, has a low VOC content and a mild curing process. Overall, Tensan silicone potting has significant advantages in many aspects and is an excellent choice for many application scenarios.
