As products in the electronic industry become more and more sophisticated, components become smaller in size, and PCB boards and products are diversified, some electronic accessories have emerged on the "stage" of the electronic industry, among which solder paste and SMT red Glue is an indispensable material in the electronics industry. What is the difference between these two products?
What is the cause of caking of silicone encapsulant during application? What is the difference between the agglomeration of the two-component silicone potting compound and the precipitation? Today, I will explain to you the following
With the increase in the demand for epoxy potting adhesives in many industries, the quality of the adhesive of this material has been improved and has been widely used. However, different brands and quality epoxy potting compounds have different prices, so that customers do not know whether to choose expensive or cheap.
Many electronic products are affected by the high temperature caused by the work, which directly leads to the rapid shortening of the service life of the product, and even stops working after the high temperature. However, the existing heat dissipation system can not meet the needs of the work at all, until the emergence of thermal grease, which effectively solves the problem of heat dissipation. The problem also reflects the importance of thermal grease. Therefore, the thermal conductivity of thermal grease is very important, so what factors will affect the thermal conductivity of thermal grease?
Thermal grease plays a vital role in the electrical appliance manufacturing industry. Unlike other adhesives, thermal grease will not cure after being applied, and the next step of construction can be carried out without waiting. In order for thermal grease to perform well, in addition to product quality, it is also necessary to pay attention to construction methods.
Thermal pads fill the air gap between a heat-generating device and a heat sink or metal base, and their flexible, resilient characteristics allow them to be used to cover very uneven surfaces. Heat is conducted from discrete components or the entire PCB to the metal enclosure or diffuser plate, increasing the efficiency and lifespan of heat-generating electronic components.
