Heatsink Thermal Pad Manufacturers

With the continuous expansion of electronic equipment application scenarios, coating, as a key material for circuit board protection, has become the focus of industry attention for its standardization and accuracy of manual glue application. Recently, a number of electronic manufacturing companies jointly revised and released a new version of the "Manual Coating Glue Application Specifications", emphasizing the optimization of details in the entire process from pretreatment to curing to improve product protection performance and production efficiency.

This article comprehensively analyzes the remarkable advantages of Tensan's thermally conductive adhesive. In terms of thermal conductivity, it has a high coefficient and stable efficiency, enabling rapid heat dissipation. Its adhesion characteristics are excellent, with strong adhesion and flexibility against deformation. The electrical insulation performance is reliable, effectively preventing short - circuits. It shows good process adaptability, being compatible with various gluing methods and curing quickly. In complex environments, it resists high and low temperatures, aging, and thermal cycling. Moreover, it complies with international environmental regulations and is safe and harmless. Through the elaboration of these advantages, its key value in multi - field applications is demonstrated.

Silicone potting has many advantages. After curing, it not only has excellent electrical insulation performance, but also has good waterproof and moisture-proof effects. It will not shrink during the curing stage. After curing, the colloid is easy to disassemble. Even if there is an electrical failure, it can be easily disassembled and repaired. What does silicone potting look like after it dries? Is it transparent?

Many electrical appliances or electronics require the use of thermal paste during the manufacturing process. Thermal paste is a paste-like substance with thermal conductivity that needs to be applied in the gap between the CPU and the radiator to provide thermal conductivity. , to prevent the CPU from being burned due to excessive local temperature. During this process, the thermal paste should pay attention to maximizing the thermal conductivity. So, how does thermal paste dissipate heat? What are the precautions?

Epoxy resins are organic polymers containing two or more epoxy groups in their molecules. Except for a few, their relative molecular weight is not high. The molecular structure of epoxy resin is characterized by the active epoxy groups in the molecular chain, which can be located at the end of the chain, in the middle, or a circular structure. Due to the active epoxy groups in the molecular structure, they can cross-link with many kinds of curing agents to form insoluble and insoluble polymers with a three-way network structure.

How to choose potting adhesive products： When choosing to use potting adhesive products, you should choose the most suitable potting adhesive products according to the requirements of the electronic product itself, potting equipment, curing equipment and other comprehensive evaluation. In the evaluation, focus on the following characteristics of potting adhesives.