multi-use adhesive sealant Manufacturers

The corporation upholds the philosophy of ""Be No.1 in excellent, be rooted on credit rating and trustworthiness for growth"", will proceed to provide aged and new buyers from home and abroad whole-heatedly for multi-use adhesive sealant,electronic silicone,adhesive sealant,electronic RTV adhesive,high quality RTV Silicone Sealant, Warmly welcome to cooperate and develop with us! we will continue to provide product with high quality and competitive price.
multi-use adhesive sealant, We welcome an opportunity to do business with you and hope to have pleasure in attaching further details of our products. Excellent quality, competitive price, punctual delivery and dependable service can be guaranteed. For further inquires be sure to do not hesitate to contact us.

Hot Products

  • Fine-Pitch Solder Paste

    Fine-Pitch Solder Paste

    TENSAN TS‑503 is a Fine-Pitch Solder Paste engineered specifically to meet these challenges. With its Type‑4 powder, optimised rheology, and unique Sn‑Ag0.3‑Bi35 alloy, this Solder paste type 4 product delivers exceptional print stability, clean stencil release, and reliable joint formation – making it the preferred Fine-Pitch Solder Paste for LED modules, smartphones, wearables, and other high‑density assemblies.
  • Silicone Base Thermal Pad

    Silicone Base Thermal Pad

    Silicone Base Thermal Pad Typical applications for Thermal pad TS300 LED lighting, lighting equipment Household appliances, LCD monitors Between the semiconductor and the heat sink. Communications products, smart phones, tablet PCs Desktop computers, laptops and other portable computers. High power Electrical appliances power supply.
  • Two-Part Thermal Potting Silicone (0.6 W/m·K) – Flame-Retardant V1 Encapsulant for LED Drivers & Power Modules

    Two-Part Thermal Potting Silicone (0.6 W/m·K) – Flame-Retardant V1 Encapsulant for LED Drivers & Power Modules

    TS8811 0.6 W/m・K Thermally Conductive Potting Compound, 1:1 two-component ratio, UL94 V1 flame retardant, is specially developed for LED drivers and power modules. It is easy to mix and cure, offering high production efficiency. After curing, it possesses excellent insulation properties to prevent short-circuit faults. It has stable thermal conductivity, accelerating component heat dissipation and extending equipment life; its excellent waterproof and moisture-proof properties resist harsh environmental corrosion. Factory direct supply, free sample testing, and customized specifications are supported.
  • Soft Thermal Silicone Pad Heat Transfer for Desktop Computer

    Soft Thermal Silicone Pad Heat Transfer for Desktop Computer

    You can rest assured to buy soft thermal silicone Pad heat transfer for desktop computer from our factory and we will offer you the best after-sale service and timely delivery. Typical applications of Thermal Pad LED lighting, lighting equipment.Household appliances, LCD monitors.Between the semiconductor and the heat sink.Communications products, smart phones, tablet PCs.Desktop computers, notebooks and other portable computers.High power Electrical appliances power supply
  • Fast-curing Adhesive

    Fast-curing Adhesive

    TENSAN Fast-curing Adhesive TS6601 is semi-flow RTV silicone with good waterproof function and sealing strength. Electronic Encapsulant Adhesive can be used for bonding metal, glass, ceramics etc. material. REACH, ROHS certified MSDS for air/sea shipment Fast curing Non-corrosive to most Copper, Polycarbonate plastics material Excellent waterproof function Excellent sealing performance Good Performance for insulation
  • High Wetting Low Voiding Lead-Free Solder Paste

    High Wetting Low Voiding Lead-Free Solder Paste

    When SMT process engineers evaluate a new supplier or manufacturer for soldering materials, voiding control consistently ranks among the top three reliability concerns – especially for QFN, LGA, and large thermal pad components. TENSAN, a Vietnam-based manufacturer with extensive experience in solder paste formulation, has developed a Low Voiding Lead-Free Solder Paste that directly addresses this challenge. The TS505 series combines a carefully balanced SAC0307 alloy with a halogen-controlled flux system designed to minimise gas entrapment, delivering consistent voiding performance that meets the stringent requirements of automotive, telecom, and industrial electronics. This article explores what makes a solder paste with low voiding performance effective, presents the key specifications of TENSAN TS505, and provides practical guidance for engineers and procurement professionals seeking a reliable soldering solution.

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