Silicone Elastomer Manufacturers

In electronics assembly, the choice of solder flux is just as critical as the alloy itself. Whether for wave soldering, selective soldering, or PCB repair and rework, a high‑quality Liquid Solder Flux ensures excellent wetting, strong joint formation, and reliable electrical performance. TENSAN offers advanced Liquid Solder Flux formulations engineered to meet the demands of modern SMT and through‑hole assembly processes. With low‑residue, no‑clean characteristics, compatibility with lead‑free and tin‑lead alloys, and stable performance across a wide range of operating conditions, this solder flux delivers the consistency and reliability that manufacturers require. As a Liquid Solder Flux, TENSAN's solution is ideal for wave soldering, selective soldering, and rework applications – providing the perfect balance of activity, residue cleanliness, and process stability.

TS107E is a widely used no‑clean, leaded solder paste based on the Tin Lead Eutectic No Clean Solder Paste eutectic alloy system. As a mature SnPb solder paste product, TS107E delivers industry‑leading performance in ultra‑fine pitch printing, head‑in‑pillow defect prevention, and in‑circuit probe test yield, making it ideal for electronic assembly applications that demand high process stability and reliability.

Our 5.0W/mK top-tier grease cools high-power components & transistors. It delivers industry-leading heat transfer, resists extreme temps, and protects parts from overheating. Perfect for industrial electronics or high-power transistors.

TS107E is a widely used no‑clean, leaded solder paste that is specifically formulated to minimise head‑in‑pillow defects in BGA and CSP soldering. As a Low Head‑in‑Pillow Defect Solder Paste, it delivers outstanding Head‑in‑pillow defect resistance, making it the ideal choice for assemblies where PCB warpage, component coplanarity variations, and thermal mismatch are critical concerns. Beyond its exceptional defect prevention, TS107E also provides excellent ultra‑fine pitch printing capability, high in‑circuit probe test yield, and long‑term reliability, ensuring robust performance in demanding electronic manufacturing environments.

TS107E is a widely used no‑clean, leaded solder paste that is offered in several powder size options. This article specifically covers the Type 4.5 version, designated as Type 4.5 Ultra‑Fine Powder Solder Paste. As a leading Solder paste type 4.5 product, TS107E delivers outstanding performance in ultra‑fine pitch printing, head‑in‑pillow defect prevention, and in‑circuit probe test yield, making it ideal for high‑density electronic assembly applications that demand exceptional printing resolution and process stability.

Black, fast-curing RTV silicone, the preferred choice for bonding and sealing LED lighting. The pure black color provides excellent light-blocking properties after curing, preventing light scattering from LED chips from affecting lighting performance. It cures at room temperature with no solvent evaporation, making it environmentally friendly and safe, and suitable for automated production. It is resistant to high and low temperatures and aging, suitable for both indoor and outdoor lighting fixtures, and offers excellent waterproof and dustproof performance. High-strength bonding effectively seals gaps and resists moisture and dust corrosion.