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  • High‑Performance Lead‑Free No‑Clean Solder Paste for Fine‑Pitch and High‑Reliability SMT Assembly

    High‑Performance Lead‑Free No‑Clean Solder Paste for Fine‑Pitch and High‑Reliability SMT Assembly

    TS505 is a high‑temperature, lead‑free, no‑clean solder paste built around a carefully engineered solder paste composition. It features the Sn99Ag0.3Cu0.7 (SAC0307) alloy, Type 4 powder (20–38 µm), a flux content of 10.5 ± 0.5 %, and a halogen‑controlled flux system (L1 level, 0.085 % halogens). This precise solder paste composition provides a wide reflow window, excellent wetting on all common board finishes, extremely low voiding, minimal non‑conductive residue, and consistent print stability over long production runs. Whether you assemble telecom infrastructure, automotive ECUs, or consumer wearables, TS505’s solder paste composition delivers the robustness and predictability that modern SMT lines demand.
  • LED thermal compound

    LED thermal compound

    Let’s walk through the advantages of Tensan TS4108A. First, it is a one‑part epoxy that cures at elevated temperatures – ideal for PCB SMD bonding. Second, its thixotropic properties are excellent, allowing smooth, repeatable application by either dispensing or stencil printing, even on high‑speed equipment. Third, after heat curing, the adhesive achieves a high mechanical strength that reliably holds components in place. Fourth, the material is certified to REACH and RoHS standards, so you can confidently use it in global markets. Finally, it is easy to mix and use – in fact, it comes pre‑mixed, so no extra preparation is required.
  • Thermal Gel

    Thermal Gel

    Thermal Gel Thermal Paste TS1101 Features & Benefits Thermal paste as the heat transfer medium of electronic components and lighting assemblies, use to reduce operating temperature of the heating element. REACH, ROHS certified High thermal conductivity Good temperature resistance
  • Chip-bonding Red Glue

    Chip-bonding Red Glue

    Developed for SMT production lines, TS4108A is a one‑part epoxy adhesive that cures at elevated temperatures. Its outstanding thixotropic behaviour ensures accurate and consistent deposition whether by high‑speed dispensing or stencil printing. The cured adhesive offers excellent mechanical strength to withstand vibration and thermal stress. It meets REACH and RoHS requirements, and its premixed single‑component formulation eliminates weighing and mixing, significantly boosting operational efficiency.
  • Thermal Pads for PCB

    Thermal Pads for PCB

    Thermal Pads for PCB Typical applications for Thermal pad TS300 LED lighting, lighting equipment Household appliances, LCD monitors Between the semiconductor and the heat sink. Communications products, smart phones, tablet PCs Desktop computers, laptops and other portable computers. High power Electrical appliances power supply.
  • Soft Silicone Thermal Pad for CPU

    Soft Silicone Thermal Pad for CPU

    Typical applications of Soft Silicone Thermal Pad for CPU LED lighting, lighting equipment.Household appliances, LCD monitors.Between the semiconductor and the heat sink.Communications products, smart phones, tablet PCs.Desktop computers, notebooks and other portable computers.High power Electrical appliances power supply
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  • What factors are related to the deep curing of silicone adhesive

    The humidity, thickness and properties of sizing will affect the deep curing of silicone adhesive

  • What are the uses of thermally conductive adhesives?

    Thermally conductive adhesive is a single component, thermally conductive, room temperature curing silicone adhesive sealant, through the condensation reaction of water in the air to release low molecules caused by cross-linking curing, and vulcanization into high-performance elastomer, thermally conductive adhesive, also known as organic silicon thermal adhesive, thermal silicone, heat dissipation silicone, heat transfer adhesive, Schneis thermal adhesive, heat dissipation adhesive, cooling adhesive

  • The difference between thermal grease and thermal conductive adhesive

    This article provides a detailed comparison between thermal conductive silicone grease and thermal conductive silicone adhesive, guiding customers in understanding their distinct characteristics and suitable applications. Although they differ by just one word in name and are both heat-conducting materials, they have significant functional and application differences. Readers will learn how to distinguish and select the right thermal material, helping to avoid adverse consequences from improper use.

  • What are the factors of bubble formation after potting adhesive curing? How to eliminate potting gum bubbles?

    The appearance of bubbles on the surface of the potting compound, the wrinkling of the surface, and the oil on the surface are all appearance problems. So why do these appearance problems occur in the potting compound, and how to eliminate the bubbles?

  • Is it good for silicone sealant to cure quickly? What are the methods for quick curing?

    There are obvious differences between silicone sealant and two-component sealant. The two are used in different fields, and the methods of use and prices are even more different. silicone sealant relies on air humidity to vulcanize. It can automatically cure without heating after construction. It has the characteristics of slow curing speed during the curing stage. It usually takes 24 hours to cure, and the performance will be stable after 72 hours.

  • The effect of heat on the LED lights

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