power modules potting Manufacturers

With the continuous innovation of electronic potting adhesives, more industries have seen its value and are used in large quantities. So what are the properties of electronic potting glue? What should you pay attention to when purchasing?

The resonant potting compound is a kind of single and double-component, thermosetting resin adhesive with excellent thermal conductivity and strength.There are two types of two-component high-temperature encapsulant:

Epoxy resins are organic polymers containing two or more epoxy groups in their molecules. Except for a few, their relative molecular weight is not high. The molecular structure of epoxy resin is characterized by the active epoxy groups in the molecular chain, which can be located at the end of the chain, in the middle, or a circular structure. Due to the active epoxy groups in the molecular structure, they can cross-link with many kinds of curing agents to form insoluble and insoluble polymers with a three-way network structure.

What are the advantages and disadvantages of LED thermal silicone pad and LED thermal grease for LED heat dissipation?

This report centers on the comparison between Tensan Red Glue and other red glues. Tensan Red Glue shows superiority in performance. It has excellent viscosity, rapid curing with good heat and chemical resistance, precise glue dot control, favorable cleaning property and high reliability. In contrast, other glues have drawbacks like unstable viscosity and weak resistance in harsh conditions. Regarding cost-effectiveness, Tensan Red Glue boosts production efficiency and cuts waste. In application, it suits consumer electronics, automotive electronics and industrial control where high performance and reliability are essential, while others are restricted in such fields. Enterprises should consider multiple factors for glue selection.

Thermal management is a critical issue in the design of electronic systems. As the complexity of the devices continues to grow, designers and manufacturers require improved technologies to effectively remove the generated heat. While fans, heat sinks and thermoelectric devices can be used to provide enough cooling power, the problem remains to get the heat from the hot components into the cooling hardware. Thermal Interface Materials (TIMs) are designed to fill in air gaps and microscopic irregularities, resulting in dramatically lower thermal resistance and thus better cooling. Shenzhen Tensan company thermal pads, thermal grease, thermal putty, thermal tape and graphite sheets can be used in a variety of electronic applications and industries including computers, laptops, tablet PCs, smart phones, routers, LEDs, solar, medical device, power supplies, wireless devices and the automotive industry. For more information you can visit our website: www.sztensan.com or www.chinatensan.com