driver thermal potting compound Manufacturers

With our loaded working experience and thoughtful products and services, we've got been acknowledged as a reputable supplier for most international buyers for driver thermal potting compound,Thermal potting compound,thermal conductive compounds,thermal potting,Thermally Conductive Encapsulant, Accurate process devices, Advanced Injection Molding Equipment, Equipment assembly line, labs and software progress are our distinguishing feature.
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Hot Products

  • Flux Solder Paste Syringe

    Flux Solder Paste Syringe

    TS‑350 is a lead‑free, no‑clean solder paste type formulated with the Sn96.5Ag3Cu0.5 (SAC305) alloy. It is engineered for demanding SMT applications where fine‑pitch printing (down to 0.25 mm / 10 mil) and high‑reliability soldering are essential. This solder paste type delivers outstanding print stability, with a viscosity of 220,000 ± 30,000 mPa·s at 25 °C and excellent slump resistance. Its advanced flux chemistry ensures rapid, complete wetting on various surface finishes, resulting in low voiding and strong resistance to head‑in‑pillow (HiP) defects – particularly beneficial for QFN and BGA assemblies. After reflow, the residue is minimal (~5 % w/w), dry, and non‑conductive, passing stringent SIR tests at both 40 °C/90 % RH and 80 °C/85 % RH. The residue is ICT‑friendly, allowing direct electrical testing without cleaning.
  • SMD Red Epoxy Glue

    SMD Red Epoxy Glue

    Features & Benefits Tensan SMD Red Epoxy Glue is a one-component epoxy adhesive, curing at high temperature. It is designed for SMD components on printed circuit board bonding. 4109A has suitable for high-speed SMT placement machine Dispensing and stencil printing. It is of high adhesive strength after curing . REACH, ROHS, certified Excellent thixotropy Good adhesive strength after curing Easy to mix and use
  • Silicone Thermal Pad for CPU

    Silicone Thermal Pad for CPU

    Silicone Thermal Pad for CPU Typical applications for Thermal pad TS300 LED lighting, lighting equipment Household appliances, LCD monitors Between the semiconductor and the heat sink. Communications products, smart phones, tablet PCs Desktop computers, laptops and other portable computers. High power Electrical appliances power supply.
  • High thermal conductivity grease

    High thermal conductivity grease

    Tensan TS4108A is a high‑temperature curing, one‑part epoxy adhesive optimised for attaching SMD components to printed circuit boards. It is fully compatible with both dispensing and stencil printing techniques used in fast‑paced SMT assembly lines, thanks to its superior thixotropic control. The cured adhesive offers high bond strength, ensuring stable component positioning throughout subsequent processes. Importantly, the product is REACH and RoHS certified, so it meets the strictest environmental standards. Furthermore, its single‑component formulation requires no mixing – simply apply directly from the cartridge or jar, reducing setup time and minimising material waste.
  • THERMAL SILICONE GEL

    THERMAL SILICONE GEL

    TS350 is a high thermal silicone gel with thermal conductivity of 3.5W/m.k.
  • Leaded Solder Paste

    Leaded Solder Paste

    TS107E is a leaded solder paste. This SnPb Solder Paste utilizes the Sn63/Pb37 eutectic alloy with a melting point of 183°C, specifically designed for ultra-fine printing and high-reliability SMT assembly. TS107E belongs to the Leaded Solder Paste category, features no-clean capability, and supports customized Solder Paste Type 3/4/4.5/5 powder sizes. It achieves printing speeds up to 150mm/s on the Solder Paste Printer; prior to use, thorough mixing via a Solder Paste Mixer is recommended to ensure uniform Solder Paste Composition. This SnPb Solder Paste is renowned for low head-in-pillow defects and best-in-class in-circuit probe test yield, and has been widely adopted in leaded process applications including communication equipment, industrial controls, and automotive electronics.

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