Heat dissipation is crucial for ensuring the lifespan and luminous effect of LED lighting fixtures. Thermally conductive silicone sheets and thermally conductive grease are commonly used heat-conducting materials, each with its own advantages and disadvantages. The choice must be made based on the application scenario and performance requirements; there is no absolutely "better" solution, only the most suitable one.
During the daily use of electronic products, issues such as overheating, performance lag, and motherboard burnout are common malfunctions. When disassembling devices for troubleshooting, one often discovers that the surface of the thermal paste has dried out and cracked. As the critical medium for heat conduction, the condition of thermal paste directly determines heat dissipation efficiency and the service life of electronic products; once cracking or pulverization occurs, the heat dissipation function is severely compromised. Based on practical application scenarios, the cracking of thermal paste is not a random occurrence; it is primarily caused by three core factors: insufficient mixing prior to application, residual low-molecular-weight components in raw materials, and an excessive oil separation rate in the product. The specific causes are broken down as follows:
The flowability of silicone potting compounds can be characterized in various ways: prior to use, the viscosity of the compound can be tested at a specific temperature, or its flow characteristics can be assessed by simulating its penetration rate; during the application process, flowability can be gauged by observing the phenomenon of thickening during curing (specifically, the "working time"). In the following sections, we will provide a detailed analysis—based on these core dimensions—of the key factors that influence the flowability of silicone potting compounds.
With the rapid development of technology, electronic devices are becoming increasingly powerful and complex. thermal potting, as key auxiliary materials, play an irreplaceable role in their production and maintenance. These liquid composites, primarily composed of silicone, possess excellent thermal conductivity, insulation, weather resistance, and corrosion resistance. Their core function is to protect circuit boards and components, improve heat dissipation performance and stability, while also facing numerous challenges, although their future development direction is clear.
Both thermal grease and thermal gel are thermal interface materials, presenting a paste-like consistency that often leads to confusion, with some even believing they differ only in name. In reality, significant distinctions exist between them. Thermal grease represents a traditional, commonly used category within thermal interface materials, whereas thermal gel is a newer material that has gained prominence in recent years. The following provides a detailed analysis of their differences.
