There are many electronic sealants on the market, which can be divided into a single component and double component according to the composition. The difference between them is that the single component can be cured directly without adding any supporting products. The two-component curing agent should be added in proportion to cure.
There are several typical sealing methods using sealant for sealant application.
You may not know, in each major electronic equipment to bring us countless convenience in the warmth of time, a lot of forgotten electronic equipment in a very important product, this is the electronic cooling paste.
Epoxy resins are organic polymers containing two or more epoxy groups in their molecules. Except for a few, their relative molecular weight is not high. The molecular structure of epoxy resin is characterized by the active epoxy groups in the molecular chain, which can be located at the end of the chain, in the middle, or a circular structure. Due to the active epoxy groups in the molecular structure, they can cross-link with many kinds of curing agents to form insoluble and insoluble polymers with a three-way network structure.
Epoxy resins are defined as "monomers or oligomers that react further to form thermosetting polymers that exhibit high chemical and solvent resistance, excellent adhesion to a variety of substrates, and low shrinkage. Curing, impact resistance, flexibility, and good electrical properties. When selecting epoxy resins, you can customize the selection of resins, modifiers, and crosslinkers to create specific characteristics for specific applications. This makes epoxy resins available for a variety of applications.
Proper use of thermal conductive adhesive can bring out the best effect.
