As a kind of thermally conductive medium, thermally conductive silicone grease has a good effect and is trusted by users. This adhesive is slightly different from other products and is involved in thermal conductivity in the form of paste. It does not need to be cured thoroughly, which saves operation time.
The potting adhesive use field is relatively large, some special areas on the potting adhesive temperature resistance performance requirements, such as some special high-temperature environment used in machinery and equipment, in the manufacturing stage of the potting adhesive high-temperature requirements, if you can not meet the performance requirements, it is easy to have problems, so you can know its importance, the following is to introduce the performance of high temperature potting adhesive aspects.
The potting adhesive is a huge adhesive field, in this field, there are potting adhesive needs to achieve low-temperature resistance performance so that it can be better used in a low-temperature environment. Users need to understand the characteristics of low-temperature potting adhesive is when they buy it, and then there is no additional performance so that you can buy the desired product.
There are more types of potting adhesives if divided according to the raw materials, respectively: silicone potting adhesive, polyurethane potting adhesive, epoxy resin potting adhesive three. Among them, polyurethane potting glue can also be called up potting glue, this glue two-component more common, single-component use rate is relatively low.
On the thermal conductivity, the same thermal conductivity of solid thermal materials, thermally conductive silicone film is certainly not as good as the liquid thermal conductive materials, but some customers feel that the liquid thermal conductive materials are not good after use, for this situation, the preliminary estimate is that the application of several problems.
Thermally conductive silicone pad is a high-performance gap filling thermal conductive material, mainly used for electronic equipment and heat sink or product shell between the transfer interface, with good adhesion, flexibility, compressibility, and excellent thermal conductivity, so that it can completely make the air between the original electronic parts and heat sink in use, to achieve full contact, heat dissipation effect is significantly improved.
