When new electronic products are introduced, depending on the process capability of the production side and the needs of the market side: IC process and chip performance, wattage has increased significantly, and the user experience must be balanced with the pursuit of thin, light, short and efficient, resulting in a high unit density of heat on the surface of the heat generating components
The purpose of thermal paste is to fill voids and defects on the surface of the contact surfaces. As modern production techniques cannot produce a defect-free surface, thermal paste is always necessary.
Owing to The Belt and Road strategy, TENSAN vigorously implement opening strategy to expand the Belt and Road. Branches and office have been opened in Thailand, Vietnam, India, the Philippines. Service localizing to improve company service efficiency. Our company firmly adhere to the profession creates value to provide excellent services for domestic and foreign customers with all-round silicone use and solutions.
Thermal conductive potting adhesive, can be cured at room temperature, can also be cured by heating, with the higher the temperature curing characteristics of the faster.
Two-component thermally conductive silicone, used as a heat transfer medium for cooling electronic devices, can be cured in position to form a soft elastomer that does not produce stress on electronic components. After curing, it fits closely to its contact surface and reduces thermal resistance, thus facilitating the heat transfer between the heat source and its surrounding heat sink, motherboard, metal case and shell, with high thermal conductivity, good insulation and ease of use.
Currently, with the development of battery technology, the product line of electric vehicles is beginning to diversify. In the case of electric supercars, for example, because of the need for frequent high-speed operation of the motor.
