china silicone adhesive sealant Manufacturers

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china silicone adhesive sealant, We're in continuous service to our growing local and international clients. We aim to be worldwide leader in this industry and with this mind; it is our great pleasure to serve and bringing the highest satisfaction rates among the growing market.

Hot Products

  • TS8811 1:1 Two-Part Thermal Potting Silicone (0.6 W/m·K) – Flame-Retardant V1 Encapsulant for LED Drivers & Power Modules, Free Sample

    TS8811 1:1 Two-Part Thermal Potting Silicone (0.6 W/m·K) – Flame-Retardant V1 Encapsulant for LED Drivers & Power Modules, Free Sample

    TS8811 0.6 W/m・K Thermally Conductive Potting Compound, 1:1 two-component ratio, UL94 V1 flame retardant, is specially developed for LED drivers and power modules. It is easy to mix and cure, offering high production efficiency. After curing, it possesses excellent insulation properties to prevent short-circuit faults. It has stable thermal conductivity, accelerating component heat dissipation and extending equipment life; its excellent waterproof and moisture-proof properties resist harsh environmental corrosion. Factory direct supply, free sample testing, and customized specifications are supported.
  • TS1105  Top-Tier Thermal Conductivity Grease 5.0W/mK for High-Power Electronic Components & Transistors

    TS1105 Top-Tier Thermal Conductivity Grease 5.0W/mK for High-Power Electronic Components & Transistors

    Our 5.0W/mK top-tier grease cools high-power components & transistors. It delivers industry-leading heat transfer, resists extreme temps, and protects parts from overheating. Perfect for industrial electronics or high-power transistors.
  • TS1009 High Efficiency Thermal Paste 3.5W/mK for PC CPU/GPU - Ideal for Gaming & Design

    TS1009 High Efficiency Thermal Paste 3.5W/mK for PC CPU/GPU - Ideal for Gaming & Design

    3.5W/mK insulated thermal paste: top cooling for GPUs & processors. It offers both strong heat transfer and insulation, resists thermal breakdown, and works in tight component spaces. Perfect for high-power electronics.
  • TS5505L Thermal Conductive Adhesive 1.3W/m·K, Specialized for LED Lighting, Quick Dry & 150℃ High Temp Resistant

    TS5505L Thermal Conductive Adhesive 1.3W/m·K, Specialized for LED Lighting, Quick Dry & 150℃ High Temp Resistant

    LED-optimised 1.3W/m·K Thermal adhesive: Engineered for COB LEDs, downlights & high-brightness fixtures. Thermal interface minimises hotspot formation in high-density arrays. 0.8 MPa shear strength. Low volatility (<0.1%) prevents lens fogging.
  • Low-Ag Low-Void No-Clean Solder Paste

    Low-Ag Low-Void No-Clean Solder Paste

    TENSAN TS-506 is a lead-free, no-clean solder paste formulated with Sn98.5Ag1.0Cu0.5 (low-silver SAC) alloy. Designed for cost-sensitive SMT applications, it delivers excellent wetting performance, low voiding rates, and stable printability across fine-pitch assemblies. TS-506 offers a broad reflow window and leaves minimal residue, making it a reliable choice for consumer electronics, automotive modules, and industrial controls where both quality and cost efficiency matter.
  • SMT Red Adhesive Glue for Stencil Printing Heat Curing

    SMT Red Adhesive Glue for Stencil Printing Heat Curing

    SMT Red Adhesive Glue for Stencil Printing Heat Curing Features & Benefits Tensan SMT red glue is a one-component epoxy adhesive, curing at high temperature. It is designed for SMD components on printed circuit board bonding. 4109A has suitable for high-speed SMT placement machine Dispensing and stencil printing. It is of high adhesive strength after curing . REACH, ROHS, certified Excellent thixotropy Good adhesive strength after curing Easy to mix and use

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