red SMD glue Manufacturers

Tensan thermal pads have outstanding performance in multiple aspects. In thermal conductivity, advanced technology enables efficient heat transfer, far better than ordinary pads. It has excellent insulation performance, preventing leakage and short circuits, while some ordinary pads have potential risks. It has a wide temperature resistance range and remains stable at high temperatures, while ordinary pads are prone to aging and failure. With good flexibility, it can closely fit heat dissipation surfaces, while ordinary pads may have poor contact. Its compression and rebound performance is excellent, maintaining well after multiple compressions, while ordinary pads have a rapid decrease in rebound rate. Although Tensan thermal pads have obvious advantages, the actual selection still needs to be comprehensively considered according to equipment and working conditions, providing an important reference for material selection in the heat dissipation field.

The application of high temperature resistant heat conductive potting compound: The application range of high temperature resistant heat conductive potting compound is wide, mainly used in the bonding, insulation, heat conduction, moisture proof, shockproof and sealing of electronic components under high temperature working conditions; the bonding and sealing of PTC sheet and aluminum heat sink, and the sensor surface Coating, fixing, bonding, sealing and insulating of plug-in wires or sheets; bonding and sealing of high-voltage caps in televisions

Nowadays, electronic products or electrical appliances are inseparable from potting glue in the production process. Potting glue can be used for the overall potting of parts and components, and can also be used for bonding and fixing electronic components. Usually two-component potting glue is more suitable for potting integral parts. After potting, it can enhance the performance of electronic products and make them safer to use. When bonding electronic components, one-component electronic potting glue is usually used, which is easy to operate and suitable for both manual gluing and automatic assembly line gluing.

The operation process of the electronic sealant is not complicated, and every step is done in place, and the sizing work is easily completed. Follow the correct process to form a high-quality adhesive layer after the adhesive is cured, so that users will not be disappointed.

How to prevent the encapsulant from drying out or drying slowly? This situation is mainly manifested in that after the encapsulant is cured, it is still soft when pressed by hand, and it has not completely hardened. Next, Shenzhen Tensan will talk about how to avoid the situation where the potting glue is not dry?

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