thermal compound Manufacturers

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thermal compound, Our products and solutions are exported worldwide. Our customers are always satisfied with our reliable quality, customer-oriented services and competitive prices. Our mission is "to continue to earn your loyalty by dedicating our efforts to the constant improvement of our merchandise and services in order to ensure the satisfaction of our end-users, customers, employees, suppliers and the worldwide communities in which we cooperate".

Hot Products

  • Standard SMD Red Glue

    Standard SMD Red Glue

    Features & Benefits Tensan Standard SMD Red Glue 4108A is a one-component epoxy adhesive, curing at high temperature. It is designed for SMD components on printed circuit board bonding. 4109A has suitable for high-speed SMT placement machine Dispensing and stencil printing. It is of high adhesive strength after curing . REACH, ROHS, certified Excellent thixotropy Good adhesive strength after curing Easy to mix and use
  • Soft Silicone Thermal Pad

    Soft Silicone Thermal Pad

    Soft Silicone Thermal Pad Typical applications for Thermal pad TS300 LED lighting, lighting equipment Household appliances, LCD monitors Between the semiconductor and the heat sink. Communications products, smart phones, tablet PCs Desktop computers, laptops and other portable computers. High power Electrical appliances power supply.
  • Low Void High Reliability Solder Paste for QFN & LGA

    Low Void High Reliability Solder Paste for QFN & LGA

    Low Void High Reliability Solder Paste for QFN & LGA – TENSAN TS‑506 is a lead‑free, no‑clean solder paste formulated specifically to address these challenges. With its Sn98.5Ag1.0Cu0.5 alloy and advanced flux chemistry, TS‑506 delivers exceptional void reduction, strong wetting, and stable printing—making it the trusted choice for high‑reliability SMT assemblies.
  • Waterproof Silione potting

    Waterproof Silione potting

    Features & Benefits of Waterproof Silione potting TS8833 Two-component silicone potting, 1 to 1, curing at room temperature.  REACH, ROHS, UL VO certified  Good waterproof  Good thermal conductivity  Easy to mix and use
  • SnAgBi Alloy Solder Paste

    SnAgBi Alloy Solder Paste

    TENSAN TS‑501 is a SnAgBi Alloy Solder Paste engineered specifically for SMT assembly processes that require lower reflow temperatures without compromising joint quality. Formulated with a Sn‑Ag1‑Bi35 alloy, this SnAgBi solder paste delivers a peak reflow temperature of 210–230°C – significantly lower than SAC305 – while providing excellent printability, strong wetting, and reliable electrical performance. With Type‑4 powder, ROL1 flux, and no‑clean residue, TS‑501 is the SnAgBi alloy solder paste that combines thermal protection with fine‑pitch capability and environmental responsibility.
  • Thermal Conductive Silicone Pad

    Thermal Conductive Silicone Pad

    Typical applications for Thermal Conductive Silicone Pad TS300 LED lighting, lighting equipment Household appliances, LCD monitors Between the semiconductor and the heat sink. Communications products, smart phones, tablet PCs Desktop computers, laptops and other portable computers. High power Electrical appliances power supply.

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