Thermal conductivity potting Manufacturers

Always customer-oriented, and it's our ultimate target to be not only the most reliable, trustable and honest supplier, but also the partner for our customers for Thermal conductivity potting,thermal conductive compounds,thermal potting,Thermally Conductive Encapsulant,silicone thermal potting compound, We welcome all with the consumers and pals to call us for mutual positive aspects. Hope to do additional company along with you.
Thermal conductivity potting, We've got been perfectly devoted to the design, R&D, manufacture, sale and service of hair products during 10 years of development. We now have introduced and are making full use of internationally advanced technology and equipment, with advantages of skilled workers. "Dedicated to providing reliable customer service" is our aim. We've been sincerely looking forward to establishing business relationships with friends from at home and abroad.

Hot Products

  • SMT Epoxy Adhesive

    SMT Epoxy Adhesive

    The TS4109B is a single-component, thermally accelerated epoxy resin system developed by Tianshan to meet the rigorous demands of modern SMT assembly. Engineered specifically for stencil printing, this red paste exhibits exceptional sag resistance, ensuring consistent deposit geometry even on thick-core boards and fine-pitch patterns.
  • Solder Paste – Automatic Mixer Compatible (Sn42Bi58)

    Solder Paste – Automatic Mixer Compatible (Sn42Bi58)

    Specifically engineered to streamline SMT preparation processes, Solder Paste – Automatic Mixer Compatible (Sn42Bi58) combines a high‑reliability flux system with fine spherical Sn42/Bi58 alloy powder. This advanced Solder paste mixer‑friendly product is formulated to achieve rapid, homogeneous mixing with minimal aeration, ensuring consistent viscosity and printability across every batch. Its eutectic composition provides a sharp melting point at 138 °C, enabling energy‑efficient reflow while protecting temperature‑sensitive components – and its robust rheology guarantees that after mixing with any standard Solder paste mixer, the paste delivers identical performance to freshly manufactured material.
  • Electronic Silicone for adapt

    Electronic Silicone for adapt

    Electronic Silicone for adapt is one-component silicone with bonding and sealing strength. It can be used for bonding metal, glass, ceramics etc. material. REACH, ROHS certified, MSDS for air/sea shipment, Non-corrosive to most metal material, Good press ratio,suitable for machine dispensing, Good adhesive strength , Good performance in extreme condition, Good flame resistance
  • Easy-Mix Thermal Potting Compound – High Performance Encapsulant for LED Driver & Electronic Modules

    Easy-Mix Thermal Potting Compound – High Performance Encapsulant for LED Driver & Electronic Modules

    TS8822 High-Performance, Easy-Mix Potting Compound: A 1:1 two-component design suitable for LED driver and power module packaging. It cures quickly at room temperature, resulting in high production efficiency. After curing, it is flexible, crack-resistant, and highly resistant to thermal shock. It offers stable thermal conductivity, effectively transferring heat from components and preventing high-temperature damage. It also boasts high waterproof and dustproof ratings, resisting harsh outdoor environments. Factory direct supply eliminates intermediaries; free samples are available, and bulk purchases enjoy greater discounts.
  • Solder Flux Paste

    Solder Flux Paste

    Solder Paste QFN350 is a zero-halogen, lead-free, water-soluble solder paste formula for both nitrogen and air reflow applications. QFN350 provides a combination of consistent print performance at wide humidity levels, excellent solderability and ease of cleaning, while maintaining a zero-halogen flux formulation.
  • Long Life Time GPU/CPU Heatsink Cooling Silicone Pad

    Long Life Time GPU/CPU Heatsink Cooling Silicone Pad

    Typical applications of Thermal Pad lies in Long Life Time GPU/CPU Heatsink Cooling Silicone Pad LED lighting, lighting equipment.Household appliances, LCD monitors.Between the semiconductor and the heat sink.Communications products, smart phones, tablet PCs.Desktop computers, notebooks and other portable computers.High power Electrical appliances power supply

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