The important properties of adhesives include rheological properties (viscosity, thixotropy, collapse-resistance and tail-dragging, storage life/condition and effective life) and mechanical properties (viscosity, mechanical strength and heat resistance, curing period, electrical stability, etc.)
Electronic adhesives for microelectronic packaging can be divided into semiconductor IC packaging adhesives and PCB board-level assembly adhesives according to packaging forms. The semiconductor IC encapsulating Adhesives are EMC, LED Encapsulant, Die Attach wrapping Adhesives, Flip Chip Underfills, Dam and Fill Encapsulant. Adhesives for PCB board assembly are SMT Adhesives, COB Encapsulant, FPC Reinforcement Adhesives, CSP/BGA Underfills, Image Sensor Assembly Adhesives, conformal coating, Encapsulant, Encapsulant, Encapsulant, Thermal conductive adhesive (Thermally conductive adhesive).
The cause of the problem: the catalyst in the glue is toxic or expired; Insufficient curing temperature or time caused by incomplete curing. The cause of the problem may be: because of measuring instrument error or human factors caused by the proportion of glue error; Failure occurs when the product exceeds or is close to the shelf-life; Reduced efficiency; Failure of catalyst in product or reduction of efficiency due to improper storage during storage; The catalyst may be toxic in the environment when used, such as phosphorus, sulfur, and nitrogen
The adhesive in many places the colloquial simply called: glue, it is simple, in the field of the daily average of 502 glue, you may have contact with might be a little more than sticky glue, shoes and much more applications in industrial engineering or adhesive, this kind of adhesive is generally used in the factory or project, the dosage is not like a family, are generally according to kg or ton to use. For a large number of adhesive, adhesive curing speed is very important for the convenience of operation, so how to choose the adhesive curing speed, what kind of curing speed is more scientific and convenient for their own adhesive?
Potting glue is to put liquid compound into the device with electronic components and circuits by mechanical or manual means, and solidified into thermosetting polymer insulating materials with excellent performance at room temperature or under heating conditions.
AB glue is two liquid mixed hardening glue another name, A liquid is this glue (resin component or A component), A liquid curing agent/hardener (B component), two liquid mixing to cure/hardening, AB glue is A two-component adhesive name. Common AB glue epoxy resin AB glue, polyurethane AB glue, silicone AB glue, acrylic AB glue, other structural AB glue, and so on.
