There are some application problems will inevitably occur during the use of encapsulant, such as volume expansion after curing; curing process is slow in winter; encapsulant removal issues after curing, etc. Shenzhen Tensan will show us in specific for the application problems and offer solutions .
TS1001 is 1.0w/m.k thermal grease , it is widely used in the electronic conponent for heat sink and fill the gap . Besides this , it is very common to use in the LED light industry , especially for the LED bulb .
What TS6603 one component RTV is ？ What is its typical application and benefits ? Tensan will guide for your a clear answer and offer you the right choice .
What are the main factors that leads to uncuring adhesive ? Tensan will be here to share with you the expertise answers and help you to solve the problem.
Thermal management is a critical issue in the design of electronic systems. As the complexity of the devices continues to grow, designers and manufacturers require improved technologies to effectively remove the generated heat. While fans, heat sinks and thermoelectric devices can be used to provide enough cooling power, the problem remains to get the heat from the hot components into the cooling hardware. Thermal Interface Materials (TIMs) are designed to fill in air gaps and microscopic irregularities, resulting in dramatically lower thermal resistance and thus better cooling. Shenzhen Tensan company thermal pads, thermal grease, thermal putty, thermal tape and graphite sheets can be used in a variety of electronic applications and industries including computers, laptops, tablet PCs, smart phones, routers, LEDs, solar, medical device, power supplies, wireless devices and the automotive industry. For more information you can visit our website: www.sztensan.com or www.chinatensan.com
What impacts may have for electronic products if using inferior potting compound ? Shenzhen Tensan company will talk about it . Using bad quality potting silicone on electronic products leads to poor electrical performance and insulation ability. Electronic components will affect each other after potting which could easily cause malfunction for electronic components . Furthermore,bad silicone potting has poor heat and cold resistance , it is difficult to bear changes between cold and heat, then the cracking cured silicone, so that rainwater penetrates into electronic components , reducing the moisture resistance of electronic products and causing electronic elements device failure. Thirdly, inferior potting compound has poor performance like poor thermal conductivity, bad high and low temperature resistance, and poor flame retardancy. It is not so effective to improve the heat transfer performance and safety factor of electronic products .
