Lead-Free High-Temperature Solder Paste Manufacturers

Our enterprise insists all along the standard policy of "product good quality is base of organization survival; client gratification could be the staring point and ending of an enterprise; persistent improvement is eternal pursuit of staff" and the consistent purpose of "reputation to start with, purchaser first" for Lead-Free High-Temperature Solder Paste, Our items are regularly supplied to lots of Groups and lots of Factories. Meanwhile, our products are sold to the USA, Italy, Singapore, Malaysia, Russia, Poland, plus the Middle East.
Lead-Free High-Temperature Solder Paste, We have more than 200 staff including experienced managers, creative designers, sophisticated engineers and skilled workers. Through hard work of all employees for the past 20 years own company grew stronger and stronger. We always apply the "client first" principle. We also always fulfill all contracts to the point and therefore enjoy excellent reputation and trust among our customers. You are very welcome to personally visit our company.We hope to start a business partnership on the basis of mutual benefit and successful development . For more information remember to do no hesitate to contact us.

Hot Products

  • SIlicone Gel

    SIlicone Gel

    TS8866 is a two-component addition-cured silicone gel, specially designed for the production of stress-relief toys. It can cure into a soft and sticky gel at room temperature, and the curing process can be accelerated by heating it to 40-50℃. The product is flexible and soft, meeting the needs of different customer groups and achieving a stress-relief effect.
  • Type 5 MicroPowder HighPrecision Solder Paste

    Type 5 MicroPowder HighPrecision Solder Paste

    TS107E is a widely used no‑clean, leaded solder paste that is offered in several powder size options. This article specifically covers the Type 5 version, designated as Type 5 Micro‑Powder High‑Precision Solder Paste. As a leading Solder paste type 5 product, TS107E delivers exceptional performance in ultra‑fine pitch printing and precision solder dotting applications, while also providing outstanding head‑in‑pillow defect prevention and in‑circuit probe test yield. It is ideally suited for the most demanding high‑density electronic assemblies where micron‑level resolution is critical.
  • High Temp Resistance Thermal Conductive Silicone Pad Silicone Mat

    High Temp Resistance Thermal Conductive Silicone Pad Silicone Mat

    Typical applications of Thermal Pad lies in High Temp Resistance Thermal Conductive Silicone Pad Silicone Mat LED lighting, lighting equipment.Household appliances, LCD monitors.Between the semiconductor and the heat sink.Communications products, smart phones, tablet PCs.Desktop computers, notebooks and other portable computers.High power Electrical appliances power supply
  • TS5505 High Thermal Conductive Silicone Sealant 1.0W/m·K , Fast Cure, Waterproof for General Electronics/LED Lighting, Factory Direct

    TS5505 High Thermal Conductive Silicone Sealant 1.0W/m·K , Fast Cure, Waterproof for General Electronics/LED Lighting, Factory Direct

    Simplify thermal interface needs: 1.0W/m·K adhesive offers reliable heat transfer for PCB assemblies and LED strips. Non-slump formula resists flow during curing. Withstands -50°C to 150°C.Compatible with dispensing guns. ISO 9001 manufactured.
  • Alloy NoClean Solder Paste

    Alloy NoClean Solder Paste

    TS107E is a widely used no‑clean, leaded solder paste based on the eutectic alloy design of Alloy No Clean Solder Paste. As a mature Solder paste 63/37 product, TS107E delivers industry‑leading performance in ultra‑fine pitch printing, head‑in‑pillow defect prevention, and in‑circuit probe test yield, making it ideal for electronic assembly applications that demand high process stability and reliability.
  • Solder Paste – Automatic Mixer Compatible (Sn42Bi58)

    Solder Paste – Automatic Mixer Compatible (Sn42Bi58)

    Specifically engineered to streamline SMT preparation processes, Solder Paste – Automatic Mixer Compatible (Sn42Bi58) combines a high‑reliability flux system with fine spherical Sn42/Bi58 alloy powder. This advanced Solder paste mixer‑friendly product is formulated to achieve rapid, homogeneous mixing with minimal aeration, ensuring consistent viscosity and printability across every batch. Its eutectic composition provides a sharp melting point at 138 °C, enabling energy‑efficient reflow while protecting temperature‑sensitive components – and its robust rheology guarantees that after mixing with any standard Solder paste mixer, the paste delivers identical performance to freshly manufactured material.

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