medium-temperature solder paste Manufacturers

With superior technologies and facilities, strict quality command, reasonable cost, exceptional provider and close co-operation with customers, we've been devoted to delivering the best benefit for our buyers for medium-temperature solder paste,solder paste,mid-temperature solder paste,low-melting-point solder paste, We sincerely welcome friends to barter business enterprise and start cooperation with us. We hope to hitch hands with close friends in different industries to produce a brilliant long run.
medium-temperature solder paste, Since always, we adhering to the "open and fair, share to get, the pursuit of excellence, and creation of value"values, adhere to the"integrity and efficient, trade-oriented, best way , best valve" business philosophy. Together with our all over the world have branches and partners to develop new business areas, maximum common values. We sincerely welcome and together we share in global resources, opening up new career together with the chapter.

Hot Products

  • TS5505M High Performance Thermal Silicone 1.5W/m·K,  Free Sample, 24H Cure for High-Power Electronics/LED Modules

    TS5505M High Performance Thermal Silicone 1.5W/m·K, Free Sample, 24H Cure for High-Power Electronics/LED Modules

    Premium 1.5W/m·K Thermal Silicone for power electronics: Servers, EV chargers & industrial PCs. Thixotropic texture – no slump on vertical surfaces. 24-hr full cure. Alumina-filled formula achieves ultra-low thermal resistance. Free sample !
  • TS5506 Pro-Grade Black RTV Adhesive for Power Modules & Heat Sinks , Extreme Temp Range (-40°C to 200°C)

    TS5506 Pro-Grade Black RTV Adhesive for Power Modules & Heat Sinks , Extreme Temp Range (-40°C to 200°C)

    Securing high-power electronics demands toughness. Our pro-grade black RTV adhesive is built for power modules, heat sinks, and transformers. Achieve UL94 V-0 flame retardancy for critical safety, withstand extreme temperatures from -40°C to 200°C, and provides robust mechanical fixation.
  • Low-Ag Low-Void No-Clean Solder Paste

    Low-Ag Low-Void No-Clean Solder Paste

    TENSAN TS-506 is a lead-free, no-clean solder paste formulated with Sn98.5Ag1.0Cu0.5 (low-silver SAC) alloy. Designed for cost-sensitive SMT applications, it delivers excellent wetting performance, low voiding rates, and stable printability across fine-pitch assemblies. TS-506 offers a broad reflow window and leaves minimal residue, making it a reliable choice for consumer electronics, automotive modules, and industrial controls where both quality and cost efficiency matter.
  • TS1003 High-Efficiency Thermal Paste (Easy to Apply)  2.0W/mK for GPU & PCB Board Cooling

    TS1003 High-Efficiency Thermal Paste (Easy to Apply) 2.0W/mK for GPU & PCB Board Cooling

    Our 2.0W/mK thermal paste is easy to apply—perfect for GPUs & PCB boards. It has a smooth, non-runny texture, fills micro-gaps quickly, and boosts heat transfer for mid-range components. Ideal for DIY builds or professional maintenance.
  • TS1008  High-Performance Thermal Paste 3.0W/mK for PC CPU Coolers & High Bay Light Cooling

    TS1008 High-Performance Thermal Paste 3.0W/mK for PC CPU Coolers & High Bay Light Cooling

    3.0W/mK thermal paste: top-tier cooling for PC CPU coolers & high bay lights. It handles intense heat, fills micro-gaps completely, and boosts heatsink performance. Ideal for overclockers or commercial lighting setups.
  • SIlicone Gel

    SIlicone Gel

    TS8866 is a two-component addition-cured silicone gel, specially designed for the production of stress-relief toys. It can cure into a soft and sticky gel at room temperature, and the curing process can be accelerated by heating it to 40-50℃. The product is flexible and soft, meeting the needs of different customer groups and achieving a stress-relief effect.

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