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solder paste for SMT assembly Manufacturers

"Sincerity, Innovation, Rigorousness, and Efficiency" is the persistent conception of our firm for that long-term to acquire with each other with buyers for mutual reciprocity and mutual reward for solder paste for SMT assembly, We've been usually looking ahead to forming profitable company interactions with new clientele within the earth.
solder paste for SMT assembly, Our company always concentrate on the development of the international market. We have now a lot of customers in Russia , European countries, the USA, the Middle East countries and Africa countries. We always follow that quality is foundation while service is guarantee to meet all customers.

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  • Lead-Free Solder Paste

    Lead-Free Solder Paste

    TENSAN TS‑501 is a Lead-Free Solder Paste engineered to meet these demands. Formulated with a Sn‑Ag1‑Bi35 alloy, this solder paste lead free solution offers a lower melting point than conventional SAC alloys, making it ideal for assemblies with thermal‑sensitive components, flexible PCBs, and step‑soldering processes. With Type‑4 powder, ROL1 flux classification, and no‑clean residue, TS‑501 is the lead-free solder paste that combines environmental responsibility with outstanding process performance.
  • Tin-Lead Composition Solder Bar Welding Material

    Tin-Lead Composition Solder Bar Welding Material

    TS‑350 is a lead‑free, no‑clean solder paste whose carefully balanced solder paste composition (SAC305 alloy, Type 4 powder, and a halogen‑free flux system) delivers outstanding printability and superior wetting. The composition ensures stable viscosity (220,000 ± 30,000 mPa·s) for fine‑pitch printing down to 0.25 mm, rapid oxide removal, and low voiding on QFN/BGA packages. It leaves a dry, non‑conductive residue (~5 % w/w) that passes SIR tests and supports ICT without cleaning.
  • Solder Paste – Automatic Mixer Compatible (Sn42Bi58)

    Solder Paste – Automatic Mixer Compatible (Sn42Bi58)

    Specifically engineered to streamline SMT preparation processes, Solder Paste – Automatic Mixer Compatible (Sn42Bi58) combines a high‑reliability flux system with fine spherical Sn42/Bi58 alloy powder. This advanced Solder paste mixer‑friendly product is formulated to achieve rapid, homogeneous mixing with minimal aeration, ensuring consistent viscosity and printability across every batch. Its eutectic composition provides a sharp melting point at 138 °C, enabling energy‑efficient reflow while protecting temperature‑sensitive components – and its robust rheology guarantees that after mixing with any standard Solder paste mixer, the paste delivers identical performance to freshly manufactured material.
  • Automatic Solder Paste Printer for PCB Board

    Automatic Solder Paste Printer for PCB Board

    TS505 is a lead‑free, high‑temperature solder paste based on the Sn99Ag0.3Cu0.7 (SAC0307) alloy (melting point 217–218°C), formulated for high‑reliability SMT assembly. Its advanced rheology ensures seamless compatibility with any solder paste printer – manual, semi‑automatic, or fully automated – delivering consistent transfer, excellent shape retention on fine‑pitch pads (down to 0.4 mm), and extended stencil life with reduced cleaning stops.
  • TS5505L Thermal Conductive Adhesive 1.3W/m·K, Specialized for LED Lighting, Quick Dry & 150℃ High Temp Resistant

    TS5505L Thermal Conductive Adhesive 1.3W/m·K, Specialized for LED Lighting, Quick Dry & 150℃ High Temp Resistant

    LED-optimised 1.3W/m·K Thermal adhesive: Engineered for COB LEDs, downlights & high-brightness fixtures. Thermal interface minimises hotspot formation in high-density arrays. 0.8 MPa shear strength. Low volatility (<0.1%) prevents lens fogging.
  • High Reliability Solder Paste for Automotive Electronics

    High Reliability Solder Paste for Automotive Electronics

    the TS-506 solder paste for automotive electronics – a proven alloy‑flux system that meets the stringent demands of engine control units, LED lighting, and sensor modules.
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    This article focuses on Tensan's solder paste, a top - tier choice in electronics manufacturing. It boasts excellent soldering performance, with quick and even spreading on welded parts, low spattering, and strong solderability for diverse components. Its high - quality alloy, made from pure metals, resists oxidation well. Notably, it shows remarkable adaptability to multiple printing and reflow soldering processes, fitting different production needs. Quality - wise, strict production control ensures consistent performance across batches. Environmentally, it adheres to RoHS and REACH, being free of harmful heavy metals. With a detailed MSDS provided, it offers safety assurances. All in all, Tensan's solder paste is a reliable option for enhancing product quality and production efficiency.

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