heatsink compound Manufacturers

Our firm has been concentrating on brand strategy. Customers' pleasure is our best advertising. We also supply OEM company for heatsink compound,thermal grease,thermal paste,thermal compound,thermal gel, Our company is working through the procedure principle of "integrity-based, cooperation created, people oriented, win-win cooperation". We hope we can have a pleasant relationship with businessman from all around the earth.
heatsink compound, Based on our guiding principle of quality is the key to development, we continually strive to exceed our customers' expectations. As such, we sincerely invite all interested companies to contact us for future cooperation, We welcome old and new customers to hold hands together for exploring and developing; For more information, please feel free to contact us. Thanks. Advanced equipment, strict quality control, customer-orientation service, initiative summary and improvement of defects and extensive industry experience enable us to guarantee more customer satisfaction and reputation which, in return, brings us more orders and benefits. If you are interested in any of our products, please feel free to contact us. Inquiry or visit to our company are warmly welcome. We sincerely hope to start a win-win and friendly partnership with you. You can see more details in our website.

Hot Products

  • TS8800 Economical 1:1 Two-Part Silicone Potting Compound – Thermal Conductive Waterproof Encapsulant for LED Drivers, Bulk Price

    TS8800 Economical 1:1 Two-Part Silicone Potting Compound – Thermal Conductive Waterproof Encapsulant for LED Drivers, Bulk Price

    TS8800 Economic 1:1 Two-Component Silicone Potting Compound, specially developed for LED drivers and power modules, offers both thermal conductivity and waterproofing. It cures at room temperature, is easy to mix, requires no special equipment, and is suitable for both automated and manual operations. After curing, it is flexible and crack-resistant, effectively protecting electronic components from moisture and dust. It offers excellent value for money, supports bulk purchases at wholesale prices, meets the stable protection needs of mid-to-low-end products, free samples are available upon request, and factory direct supply ensures fast delivery.
  • Lead-Free High-Temperature Solder Paste

    Lead-Free High-Temperature Solder Paste

    TS-350-1 is a lead-free high-temperature solder paste. This SnAgCu Solder Paste utilizes the Sn96.5Ag3Cu0.5 (SAC305) alloy system with a melting point of 221–227°C, specifically designed for high-reliability electronic assembly. TS-350-1 is precision-engineered with Solder Paste Type 4 (20–38μm) spherical solder powder and Solder Flux, delivering excellent printing performance and extended stencil life on the Solder Paste Printer. Prior to use, thorough mixing via a Solder Paste Mixer is recommended to ensure uniform Solder Paste Composition. This Solder Paste Lead Free product has been widely adopted in high-temperature soldering applications including telecom base stations, server motherboards, automotive electronics, and industrial controls.
  • Low-Temperature SnAgBi Solder Paste

    Low-Temperature SnAgBi Solder Paste

    TS‑503 is the ideal SnAgBi solder paste choice for LED lighting, consumer electronics, flexible PCBs, and other heat‑sensitive assemblies – providing the perfect balance of thermal protection, reliability, and cost‑effectiveness
  • Type 5 MicroPowder HighPrecision Solder Paste

    Type 5 MicroPowder HighPrecision Solder Paste

    TS107E is a widely used no‑clean, leaded solder paste that is offered in several powder size options. This article specifically covers the Type 5 version, designated as Type 5 Micro‑Powder High‑Precision Solder Paste. As a leading Solder paste type 5 product, TS107E delivers exceptional performance in ultra‑fine pitch printing and precision solder dotting applications, while also providing outstanding head‑in‑pillow defect prevention and in‑circuit probe test yield. It is ideally suited for the most demanding high‑density electronic assemblies where micron‑level resolution is critical.
  • SnAgBi Alloy Solder Paste

    SnAgBi Alloy Solder Paste

    TENSAN TS‑501 is a SnAgBi Alloy Solder Paste engineered specifically for SMT assembly processes that require lower reflow temperatures without compromising joint quality. Formulated with a Sn‑Ag1‑Bi35 alloy, this SnAgBi solder paste delivers a peak reflow temperature of 210–230°C – significantly lower than SAC305 – while providing excellent printability, strong wetting, and reliable electrical performance. With Type‑4 powder, ROL1 flux, and no‑clean residue, TS‑501 is the SnAgBi alloy solder paste that combines thermal protection with fine‑pitch capability and environmental responsibility.
  • Low-Ionic Activator System

    Low-Ionic Activator System

    As a fully compliant solution for environmentally conscious electronics assembly, Low‑Ionic Activator System is a high‑performance Solder flux formulated specifically for Sn42/Bi58 eutectic solder pastes. This advanced Solder flux combines a low‑ionic activator with a carefully balanced resin and solvent system, delivering exceptional printability, minimal residue, and robust electrical reliability – all while meeting the strictest global restrictions on hazardous substances. When used with SnBi alloy powder, this Solder flux enables a sharp melting point at 138 °C, supporting energy‑efficient reflow and protecting temperature‑sensitive components. With a powder particle size of 25–45 μm (spanning Type 3 and Type 4), the Solder flux ensures excellent stencil release and process stability across both conventional and fine‑pitch SMT lines.

Send Inquiry