heatsink compound Manufacturers

Our firm has been concentrating on brand strategy. Customers' pleasure is our best advertising. We also supply OEM company for heatsink compound,thermal grease,thermal paste,thermal compound,thermal gel, Our company is working through the procedure principle of "integrity-based, cooperation created, people oriented, win-win cooperation". We hope we can have a pleasant relationship with businessman from all around the earth.
heatsink compound, Based on our guiding principle of quality is the key to development, we continually strive to exceed our customers' expectations. As such, we sincerely invite all interested companies to contact us for future cooperation, We welcome old and new customers to hold hands together for exploring and developing; For more information, please feel free to contact us. Thanks. Advanced equipment, strict quality control, customer-orientation service, initiative summary and improvement of defects and extensive industry experience enable us to guarantee more customer satisfaction and reputation which, in return, brings us more orders and benefits. If you are interested in any of our products, please feel free to contact us. Inquiry or visit to our company are warmly welcome. We sincerely hope to start a win-win and friendly partnership with you. You can see more details in our website.

Hot Products

  • SMT Red Adhesive Glue for Stencil Printing Heat Curing

    SMT Red Adhesive Glue for Stencil Printing Heat Curing

    SMT Red Adhesive Glue for Stencil Printing Heat Curing Features & Benefits Tensan SMT red glue is a one-component epoxy adhesive, curing at high temperature. It is designed for SMD components on printed circuit board bonding. 4109A has suitable for high-speed SMT placement machine Dispensing and stencil printing. It is of high adhesive strength after curing . REACH, ROHS, certified Excellent thixotropy Good adhesive strength after curing Easy to mix and use
  • TS5505H Ultra High Thermal Conductive Sealant 2.3W/m·K, Industrial Grade for Server/High-Power LED Cooling

    TS5505H Ultra High Thermal Conductive Sealant 2.3W/m·K, Industrial Grade for Server/High-Power LED Cooling

    Industry-leading performance: 2.3W/m·K thermal compound slashes hotspot temps in wind turbine converters and RF modules. Stable from. Free thermal mapping for your PCB design!
  • TS8822 Easy-Mix Thermal Potting Compound – High Performance Encapsulant for LED Driver & Electronic Modules, Competitive Price

    TS8822 Easy-Mix Thermal Potting Compound – High Performance Encapsulant for LED Driver & Electronic Modules, Competitive Price

    TS8822 High-Performance, Easy-Mix Potting Compound: A 1:1 two-component design suitable for LED driver and power module packaging. It cures quickly at room temperature, resulting in high production efficiency. After curing, it is flexible, crack-resistant, and highly resistant to thermal shock. It offers stable thermal conductivity, effectively transferring heat from components and preventing high-temperature damage. It also boasts high waterproof and dustproof ratings, resisting harsh outdoor environments. Factory direct supply eliminates intermediaries; free samples are available, and bulk purchases enjoy greater discounts.
  • TS505

    TS505

    This product is ROHS, REACH compliant. It does not contain any unknow carcinogenic, mutagenic or teratogenic components.
  • TS1105  Top-Tier Thermal Conductivity Grease 5.0W/mK for High-Power Electronic Components & Transistors

    TS1105 Top-Tier Thermal Conductivity Grease 5.0W/mK for High-Power Electronic Components & Transistors

    Our 5.0W/mK top-tier grease cools high-power components & transistors. It delivers industry-leading heat transfer, resists extreme temps, and protects parts from overheating. Perfect for industrial electronics or high-power transistors.
  • TS8833 High Thermal Conductivity & UL94 V-0 Flame-Retardant Potting Compound 1:1 – Heavy-Duty Encapsulant for LED Drivers & Converters

    TS8833 High Thermal Conductivity & UL94 V-0 Flame-Retardant Potting Compound 1:1 – Heavy-Duty Encapsulant for LED Drivers & Converters

    TS8833 Heavy-Duty Potting Compound: A 1:1 two-component design with high thermal conductivity and UL94 V-0 flame retardancy. Specifically developed for LED drivers and power converters. It has excellent flowability, penetrating deep into component gaps to form a dense protective layer. After curing, it is resistant to high and low temperatures and UV aging. Highly efficient thermal conductivity prevents component overheating, flame retardant properties eliminate fire hazards, and it offers excellent waterproof and moisture-proof performance. Factory direct supply, free samples, and customized specifications are available to meet the needs of high-end equipment.

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