Solder flux ； Manufacturers

4.5W/mK flagship thermal paste: customizable for laptop CPU/GPU heavy-duty cooling. It’s engineered for intense operation, can be adjusted to fit your device, and delivers industry-leading heat transfer. A premium choice.

In modern electronics manufacturing, not all assemblies can withstand the high peak temperatures required by standard SAC305 solder paste. Heat‑sensitive components, flexible PCBs, LED modules, and multi‑step reflow processes demand a Medium-Temperature Solder Paste that can form reliable solder joints at lower temperatures without compromising quality. TENSAN TS‑503 is precisely such a solder paste 503 – a low‑silver, bismuth‑containing Medium-Temperature Solder Paste engineered to deliver excellent wetting, stable printing, and reliable joint formation at significantly reduced reflow temperatures. This solder paste 503 is the ideal choice for manufacturers seeking to protect thermal‑sensitive components while maintaining production efficiency and cost‑effectiveness.

In electronics assembly, the choice of solder flux is just as critical as the alloy itself. Whether for wave soldering, selective soldering, or PCB repair and rework, a high‑quality Liquid Solder Flux ensures excellent wetting, strong joint formation, and reliable electrical performance. TENSAN offers advanced Liquid Solder Flux formulations engineered to meet the demands of modern SMT and through‑hole assembly processes. With low‑residue, no‑clean characteristics, compatibility with lead‑free and tin‑lead alloys, and stable performance across a wide range of operating conditions, this solder flux delivers the consistency and reliability that manufacturers require. As a Liquid Solder Flux, TENSAN's solution is ideal for wave soldering, selective soldering, and rework applications – providing the perfect balance of activity, residue cleanliness, and process stability.

TENSAN TS‑503 is an RMA Solder Paste engineered to meet these demands while offering the added benefits of a medium‑temperature, low‑silver Sn‑Ag0.3‑Bi35 alloy. This advanced solder paste delivers superior wetting, low voiding, and stable printability – with a flux system that leaves clear, soft, non‑corrosive, and non‑conductive residues. As a true RMA Solder Paste, TS‑503 is the preferred solder paste for manufacturers who require reliable soldering performance across a wide range of applications, from LED lighting and consumer electronics to automotive and telecommunications assemblies.

TENSAN mid-temperature lead-free solder paste is formulated with Sn-Ag1-Bi35 alloy, offering a unique melting point profile ideal for heat-sensitive components and multi-step reflow processes. This solder paste delivers excellent printability, low residue, and reliable soldering performance at lower peak temperatures than standard SAC alloys. With Type 4 powder size and ROL1 flux classification, this mid-temperature solder paste is the preferred choice for consumer electronics, automotive modules, and LED lighting assemblies where thermal management is critical.

TS505 is a high‑temperature, lead‑free, no‑clean solder paste formulated with the Sn99Ag0.3Cu0.7 (SAC0307) alloy and utilising solder paste type 4 powder (20–38 μm) as the standard particle size. This solder paste type 4 is engineered to deliver excellent print stability, superior wetting, and low voiding across a wide range of SMT applications – from fine‑pitch consumer devices (down to 0.4 mm) to large‑format telecom and automotive boards. Key advantages include a wide reflow window (peak 240–250°C, with 60–90 seconds above liquidus), minimal non‑conductive residue (~0.085% halogen, L1 level), and high SIR values (≥1.0×10⁸Ω at 40°C/90% RH and ≥5.0×10⁸Ω at 80°C/85% RH). The Type 4 powder ensures consistent aperture release, extended stencil life, and reduced cleaning frequency. TS505 supports both air and nitrogen reflow and is fully RoHS compliant.