Solder paste lead free； Manufacturers

As a fully compliant solution for environmentally conscious electronics assembly, Sn42Bi58 Solder Paste Composition represents a complete formulation that integrates high‑purity Sn42/Bi58 eutectic alloy powder, a low‑ionic activator system, and carefully balanced solvents and rheology modifiers. This advanced Solder paste composition is engineered to deliver exceptional printability, minimal residue, and robust electrical reliability – all while meeting the strictest global restrictions on hazardous substances. The eutectic alloy provides a sharp melting point at 138 °C, enabling energy‑efficient reflow and protecting temperature‑sensitive components. With a powder particle size of 25–45 μm (spanning Type 3 and Type 4), this Solder paste composition ensures excellent stencil release and process stability across both conventional and fine‑pitch SMT lines.

TENSAN TS-506 is a lead-free, no-clean solder paste formulated with Sn98.5Ag1.0Cu0.5 (low-silver SAC) alloy. Designed for cost-sensitive SMT applications, it delivers excellent wetting performance, low voiding rates, and stable printability across fine-pitch assemblies. TS-506 offers a broad reflow window and leaves minimal residue, making it a reliable choice for consumer electronics, automotive modules, and industrial controls where both quality and cost efficiency matter.

Premium Printing Solder Paste for SMT Assembly – TENSAN TS-506 is a low-silver, no-clean solder paste engineered to deliver the perfect balance between cost and performance. With its Sn98.5Ag1.0Cu0.5 alloy composition, TS-506 offers excellent wetting, low voiding, and stable printing—all at a more affordable price point than traditional SAC305 pastes.

TS107E is a widely used no‑clean, leaded solder paste based on the eutectic alloy design of Alloy No Clean Solder Paste. As a mature Solder paste 63/37 product, TS107E delivers industry‑leading performance in ultra‑fine pitch printing, head‑in‑pillow defect prevention, and in‑circuit probe test yield, making it ideal for electronic assembly applications that demand high process stability and reliability.

TS505 is a high-temperature, lead-free, no-clean solder paste type formulated with the Sn99Ag0.3Cu0.7 (SAC0307) alloy system. This solder paste type has been specifically designed for high-reliability electronic assembly, offering outstanding performance in wettability, low voiding, stencil life, and residue cleanliness. It is widely deployed across SMT processes in consumer electronics, communication equipment, automotive electronics, and industrial control applications.

TS107E is a widely used no‑clean, leaded solder paste that is offered in several powder size options. This article specifically covers the Type 4.5 version, designated as Type 4.5 Ultra‑Fine Powder Solder Paste. As a leading Solder paste type 4.5 product, TS107E delivers outstanding performance in ultra‑fine pitch printing, head‑in‑pillow defect prevention, and in‑circuit probe test yield, making it ideal for high‑density electronic assembly applications that demand exceptional printing resolution and process stability.