Solder paste ； Manufacturers

TENSAN TS‑501 is a Lead-Free Solder Paste engineered to meet these demands. Formulated with a Sn‑Ag1‑Bi35 alloy, this solder paste lead free solution offers a lower melting point than conventional SAC alloys, making it ideal for assemblies with thermal‑sensitive components, flexible PCBs, and step‑soldering processes. With Type‑4 powder, ROL1 flux classification, and no‑clean residue, TS‑501 is the lead-free solder paste that combines environmental responsibility with outstanding process performance.

TENSAN TS‑503 is a lead‑free, no‑clean solder paste designed for medium‑temperature reflow processes.

3.5W/mK insulated thermal paste: top cooling for GPUs & processors. It offers both strong heat transfer and insulation, resists thermal breakdown, and works in tight component spaces. Perfect for high-power electronics.

In modern electronics manufacturing, not all assemblies can withstand the high peak temperatures required by standard SAC305 solder paste. Heat‑sensitive components, flexible PCBs, LED modules, and multi‑step reflow processes demand a Medium-Temperature Solder Paste that can form reliable solder joints at lower temperatures without compromising quality. TENSAN TS‑503 is precisely such a solder paste 503 – a low‑silver, bismuth‑containing Medium-Temperature Solder Paste engineered to deliver excellent wetting, stable printing, and reliable joint formation at significantly reduced reflow temperatures. This solder paste 503 is the ideal choice for manufacturers seeking to protect thermal‑sensitive components while maintaining production efficiency and cost‑effectiveness.

TS-350 is a lead-free, no-clean solder paste based on SAC305 alloy, with a melting point of 221–227°C, Type 4 powder size (20–38 μm), flux content of 10.5±0.5%, viscosity of 220,000 mPa·s, and halogen content meeting L0 level. Key Advantages: Stable printing with excellent shape retention, supporting ultra-fine pitch down to 0.28mm; strong wetting performance, low voiding, minimal residue, compatible with air/nitrogen reflow; effective head-in-pillow (HiP) resistance for improved first-pass yield; RoHS compliant. Storage: Refrigerate at 2–10°C (do not freeze), 6-month shelf life. Allow 4+ hours of sealed warm-up before use, followed by 1–2 minutes of mixing. Applications: Consumer electronics, automotive electronics, industrial controls, telecommunications, medical devices, LED lighting.

TS-502 is a lead-free low-temperature solder paste. This SnBi Solder Paste features a eutectic melting point of only 138°C, specifically designed for soldering heat-sensitive components and flexible substrates. TS-502 is precision-engineered with Type 3/4 spherical solder powder and Solder Flux to deliver excellent continuous printing resolution on the Solder Paste Printer. Prior to use, thorough mixing via a Solder Paste Mixer is recommended to ensure uniform Solder Paste Composition. This Solder Paste Lead Free product has been widely adopted in low-temperature assembly applications including LED modules, sensors, and high-frequency components, with sufficient monthly production capacity to guarantee stable supply.