Solder paste printer ； Manufacturers

Premium Printing Solder Paste for SMT Assembly – TENSAN TS-506 is a low-silver, no-clean solder paste engineered to deliver the perfect balance between cost and performance. With its Sn98.5Ag1.0Cu0.5 alloy composition, TS-506 offers excellent wetting, low voiding, and stable printing—all at a more affordable price point than traditional SAC305 pastes.

Precision bonding demands precision materials. This white RTV silicone features: Self-Levelling Flow for bubble-free, uniform thin films. Dust/water resistance and maintains adhesion and elasticity across a wide temperature range.

TS505 is a high‑temperature, lead‑free solder paste based on the Sn99Ag0.3Cu0.7 (SAC0307) alloy (melting point 217–218°C), engineered for high‑reliability SMT assembly. Its performance begins with proper paste preparation – a task that relies on a reliable solder paste mixer. After refrigerated storage, TS505 responds predictably to mixing (1–2 minutes in a planetary or centrifugal solder paste mixer), restoring uniform flux distribution and optimal viscosity for consistent printing.

As a fully compliant solution for environmentally conscious electronics assembly, Low‑Ionic Activator System is a high‑performance Solder flux formulated specifically for Sn42/Bi58 eutectic solder pastes. This advanced Solder flux combines a low‑ionic activator with a carefully balanced resin and solvent system, delivering exceptional printability, minimal residue, and robust electrical reliability – all while meeting the strictest global restrictions on hazardous substances. When used with SnBi alloy powder, this Solder flux enables a sharp melting point at 138 °C, supporting energy‑efficient reflow and protecting temperature‑sensitive components. With a powder particle size of 25–45 μm (spanning Type 3 and Type 4), the Solder flux ensures excellent stencil release and process stability across both conventional and fine‑pitch SMT lines.

TENSAN TS‑501 is a lead‑free, Bi‑containing alloy paste that lowers reflow temperatures while maintaining excellent printability and joint reliability. It is the ideal solder paste for automated printing environments where stability, cleanliness, and process flexibility are paramount. With Type‑4 powder, ROL1 flux, and long stencil life, this Automatic Solder Paste Printer solution ensures that every print – from the first to the thousandth – meets the highest quality standards.

As a fully compliant solution for environmentally conscious electronics assembly, Sn42Bi58 Solder Paste Composition represents a complete formulation that integrates high‑purity Sn42/Bi58 eutectic alloy powder, a low‑ionic activator system, and carefully balanced solvents and rheology modifiers. This advanced Solder paste composition is engineered to deliver exceptional printability, minimal residue, and robust electrical reliability – all while meeting the strictest global restrictions on hazardous substances. The eutectic alloy provides a sharp melting point at 138 °C, enabling energy‑efficient reflow and protecting temperature‑sensitive components. With a powder particle size of 25–45 μm (spanning Type 3 and Type 4), this Solder paste composition ensures excellent stencil release and process stability across both conventional and fine‑pitch SMT lines.