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Hot Products

  • TinLead Eutectic NoClean Solder Paste

    TinLead Eutectic NoClean Solder Paste

    TS107E is a widely used no‑clean, leaded solder paste based on the Tin Lead Eutectic No Clean Solder Paste eutectic alloy system. As a mature SnPb solder paste product, TS107E delivers industry‑leading performance in ultra‑fine pitch printing, head‑in‑pillow defect prevention, and in‑circuit probe test yield, making it ideal for electronic assembly applications that demand high process stability and reliability.
  • TS1003 High-Efficiency Thermal Paste (Easy to Apply)  2.0W/mK for GPU & PCB Board Cooling

    TS1003 High-Efficiency Thermal Paste (Easy to Apply) 2.0W/mK for GPU & PCB Board Cooling

    Our 2.0W/mK thermal paste is easy to apply—perfect for GPUs & PCB boards. It has a smooth, non-runny texture, fills micro-gaps quickly, and boosts heat transfer for mid-range components. Ideal for DIY builds or professional maintenance.
  • Low-Ionic Activator System

    Low-Ionic Activator System

    As a fully compliant solution for environmentally conscious electronics assembly, Low‑Ionic Activator System is a high‑performance Solder flux formulated specifically for Sn42/Bi58 eutectic solder pastes. This advanced Solder flux combines a low‑ionic activator with a carefully balanced resin and solvent system, delivering exceptional printability, minimal residue, and robust electrical reliability – all while meeting the strictest global restrictions on hazardous substances. When used with SnBi alloy powder, this Solder flux enables a sharp melting point at 138 °C, supporting energy‑efficient reflow and protecting temperature‑sensitive components. With a powder particle size of 25–45 μm (spanning Type 3 and Type 4), the Solder flux ensures excellent stencil release and process stability across both conventional and fine‑pitch SMT lines.
  • Stencil Printer for SMT

    Stencil Printer for SMT

    TENSAN TS‑503 is a No-Clean Solder Paste engineered specifically to excel on any solder paste printer. With its unique Sn‑Ag0.3‑Bi35 alloy, Type‑4 powder (20–38 μm), and optimised rheology, TS‑503 delivers exceptional print stability, long stencil life (>8 hours), and consistent transfer efficiency – making it the ideal solder paste for high‑volume, medium‑temperature SMT production. Whether you operate a fully automatic Stencil Printer for SMT or a semi‑automatic system, TS‑503 adapts to your process, ensuring sharp deposits, minimal slump, and reliable solder joints
  • TS9933 High Transparency Non-Yellowing Silicone Elastomer - Special for LED Displays/Luminaires, Waterproof Insulation for Power Electronics

    TS9933 High Transparency Non-Yellowing Silicone Elastomer - Special for LED Displays/Luminaires, Waterproof Insulation for Power Electronics

    TS9933 is the ultimate high-transparency silicone elastomer for LED displays and luminaires. Its 95% light transmittance ensures optimal LED performance, while its non-yellowing formula prevents the "cloudy" look that plagues other clear compounds. The compound’s waterproof insulation, protecting against rain and humidity, and the 10:1 ratio reduces mixing time in production. Curing into a flexible, tear-resistant material, it withstands temperature changes and mechanical stress—perfect for outdoor displays or commercial luminaires.
  • Low Voiding Lead-Free Solder Paste

    Low Voiding Lead-Free Solder Paste

    TENSAN TS505 is formulated with these principles at its core. The solder paste with low voiding performance uses a halogen-controlled flux (L1 level, 0.085% halogens) and a carefully matched solvent system to release volatiles gradually, avoiding violent boiling that would otherwise trap gas underneath large thermal pads.

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