Elastic Silicone Gel Manufacturers

The thermal coefficient of thermal grease is different in components of different materials. Specific parameters are generally described, and related data can also be found on the Internet. Generally, the substitution of thermal grease in air which is very low.

Silicone potting adhesive has many advantages and has long been widely used in a variety of fields, such as the production of household appliances, soft pack batteries, outdoor power supply, lithium batteries, sensors, LED lights, displays, and so on. In the process of use often encounter some problems, and most of these problems stem from the shortcomings of silicone potting adhesive know, weigh the pros and cons before buying and using to show good performance.

TENSAN Electronic Adhesive stands out in the electronics field. It has excellent bonding performance and can firmly bond various materials commonly used in electronic components. With good thermal conductivity, it helps electronic devices dissipate heat efficiently. Its curing characteristics are flexible, adapting to different construction conditions. It has a wide temperature resistance range and can work stably in both high and low temperature environments. It has outstanding environmental performance and is friendly to the environment and operators. High stability ensures its reliability during long-term use. In terms of cost-effectiveness, although it is positioned in the mid-to-high price range, its comprehensive advantages are significant. Compared with other electronic adhesives, it can better meet the needs of all aspects in the production and use of electronic devices, making it one of the top choices for high-quality electronic bonding applications....

Tensan thermal pads have outstanding performance in multiple aspects. In thermal conductivity, advanced technology enables efficient heat transfer, far better than ordinary pads. It has excellent insulation performance, preventing leakage and short circuits, while some ordinary pads have potential risks. It has a wide temperature resistance range and remains stable at high temperatures, while ordinary pads are prone to aging and failure. With good flexibility, it can closely fit heat dissipation surfaces, while ordinary pads may have poor contact. Its compression and rebound performance is excellent, maintaining well after multiple compressions, while ordinary pads have a rapid decrease in rebound rate. Although Tensan thermal pads have obvious advantages, the actual selection still needs to be comprehensively considered according to equipment and working conditions, providing an important reference for material selection in the heat dissipation field.

The use of highly thermally conductive thermal interface materials to fill these gaps and remove the air from them, creates an effective heat transfer path between the electronic components and the heat sink, significantly reducing the contact thermal resistance and allowing the heat sink to be fully utilised. Thermal interface (contact surface) materials play a very critical role in thermal management and are an important branch of research in this discipline.

As we know, among the thermally conductive raw materials, thermally conductive pads are mainly composite materials based on silicone raw materials, which are very commonly used. However, due to the diversification of the use of silicone management systems, a widespread risk of volatilisation and oil leakage is gradually becoming a concern.