Solder paste type 3 / type 4; Manufacturers

Our pursuit and enterprise aim would be to "Always fulfill our buyer requirements". We carry on to acquire and layout excellent quality items for the two our old and new clients and realize a win-win prospect for our shoppers in addition as us for Solder paste type 3 / type 4;,Solder paste ;,Solder paste printer ;,Solder paste mixer;,Solder paste lead free;, Prospects first! Whatever you require, we should do our utmost to help you. We warmly welcome clients from all around the globe to cooperate with us for mutual enhancement.
Solder paste type 3 / type 4;, There are advanced producing & processing equipment and skilled workers to ensure the merchandise with high quality. We now have found an excellent before-sale, sale, after-sale service to ensure the customers that could rest assured to make orders. Until now our goods are now moving on fast and very popular in South America, East Asia, the Middle east, Africa, etc.

Hot Products

  • TS1006 High Thermal Conductivity Grease 2.5W/mK for Power Supplies & Lighting Assembly

    TS1006 High Thermal Conductivity Grease 2.5W/mK for Power Supplies & Lighting Assembly

    2.5W/mK thermal grease: high conductivity for power supplies & lighting. It’s engineered to handle continuous operation, reduces heat buildup, and is durable in harsh environments. A top pick for industrial electronics.
  • Low HeadinPillow Defect Solder Paste

    Low HeadinPillow Defect Solder Paste

    TS107E is a widely used no‑clean, leaded solder paste that is specifically formulated to minimise head‑in‑pillow defects in BGA and CSP soldering. As a Low Head‑in‑Pillow Defect Solder Paste, it delivers outstanding Head‑in‑pillow defect resistance, making it the ideal choice for assemblies where PCB warpage, component coplanarity variations, and thermal mismatch are critical concerns. Beyond its exceptional defect prevention, TS107E also provides excellent ultra‑fine pitch printing capability, high in‑circuit probe test yield, and long‑term reliability, ensuring robust performance in demanding electronic manufacturing environments.
  • Soft Silicone Type Thermal Mat/Thermal Pad for Electronics TS300

    Soft Silicone Type Thermal Mat/Thermal Pad for Electronics TS300

    Soft Silicone Type Thermal Mat/Thermal Pad for Electronics of Thermal Pad LED lighting,lighting equipment.Household appliances, LCD monitors.Between the semiconductor and the heat sink.Communications products, smart phones, tablet PCs.Desktop computers, notebooks and other portable computers.High power Electrical appliances power supply.
  • TS6603 Room-Curing White RTV Silicone Sealant – High Performance Encapsulant for LED Street Light Waterproof Bonding

    TS6603 Room-Curing White RTV Silicone Sealant – High Performance Encapsulant for LED Street Light Waterproof Bonding

    White RTV silicone sealant specifically designed for outdoor lighting, featuring a pure white matte finish that complements various white lamp housings. After curing, the pure white sealant provides a clean appearance, strong coverage, and enhances the aesthetics of the lamp's internal structure. It boasts excellent waterproof and moisture-proof properties, effectively preventing moisture from corroding the LED chips and circuitry. Curing at room temperature without solvents, it is environmentally friendly and safe, and compatible with automated dispensing processes. Weather-resistant and anti-aging, it will not crack or peel off when used in outdoor streetlights and garden lights.
  • Low Void High Reliability Solder Paste for QFN & LGA

    Low Void High Reliability Solder Paste for QFN & LGA

    Low Void High Reliability Solder Paste for QFN & LGA – TENSAN TS‑506 is a lead‑free, no‑clean solder paste formulated specifically to address these challenges. With its Sn98.5Ag1.0Cu0.5 alloy and advanced flux chemistry, TS‑506 delivers exceptional void reduction, strong wetting, and stable printing—making it the trusted choice for high‑reliability SMT assemblies.
  • Low-Temperature Solder Paste (Sn42Bi58)

    Low-Temperature Solder Paste (Sn42Bi58)

    As a leading solution in low‑temperature soldering, Low‑Temperature Solder Paste (Sn42Bi58) combines a high‑reliability flux system with fine spherical Sn42/Bi58 alloy powder. This advanced Solder Paste is engineered to deliver exceptional printability, minimal residue, and robust electrical performance, making it an ideal choice for heat‑sensitive assemblies and high‑density interconnects. Its eutectic composition ensures a sharp melting point at 138 °C, enabling energy‑efficient reflow and protecting temperature‑critical components.

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