High-quality thermal potting Manufacturers

In electronics assembly, the choice of solder flux is just as critical as the alloy itself. Whether for wave soldering, selective soldering, or PCB repair and rework, a high‑quality Liquid Solder Flux ensures excellent wetting, strong joint formation, and reliable electrical performance. TENSAN offers advanced Liquid Solder Flux formulations engineered to meet the demands of modern SMT and through‑hole assembly processes. With low‑residue, no‑clean characteristics, compatibility with lead‑free and tin‑lead alloys, and stable performance across a wide range of operating conditions, this solder flux delivers the consistency and reliability that manufacturers require. As a Liquid Solder Flux, TENSAN's solution is ideal for wave soldering, selective soldering, and rework applications – providing the perfect balance of activity, residue cleanliness, and process stability.

As a fully compliant solution for environmentally conscious electronics assembly, Low‑Ionic Activator System is a high‑performance Solder flux formulated specifically for Sn42/Bi58 eutectic solder pastes. This advanced Solder flux combines a low‑ionic activator with a carefully balanced resin and solvent system, delivering exceptional printability, minimal residue, and robust electrical reliability – all while meeting the strictest global restrictions on hazardous substances. When used with SnBi alloy powder, this Solder flux enables a sharp melting point at 138 °C, supporting energy‑efficient reflow and protecting temperature‑sensitive components. With a powder particle size of 25–45 μm (spanning Type 3 and Type 4), the Solder flux ensures excellent stencil release and process stability across both conventional and fine‑pitch SMT lines.

Electronics Thermal Conductive Pad Typical applications for Thermal pad TS300 LED lighting, lighting equipment Household appliances, LCD monitors Between the semiconductor and the heat sink. Communications products, smart phones, tablet PCs Desktop computers, laptops and other portable computers. High power Electrical appliances power supply.

TS-350 is a high-performance no-clean SAC305 lead-free solder paste engineered to solve core pain points of modern high-yield SMT production, including inconsistent printing, voids, Head-in-Pillow (HiP) defects and low first-pass yield. Optimized for ultra-fine pitch miniaturized components, it balances stable rheology, powerful flux activation and reliable long-term electrical performance, compatible with mass manufacturing and precision rework across consumer, automotive, medical, telecom and industrial electronics.

Non-corrosive Adhesive Sealant TS5501 is one-component silicone with bonding and sealing strength. It can be used for bonding metal, glass, ceramics etc. material. REACH, ROHS certified MSDS for air/sea shipment Non-corrosive to most metal material Good press ratio,suitable for machine dispensing Good adhesive strength Good performance in extreme condition Good flame resistance

Stable Silicone Type Thermal Grease Features & Benefits Thermal Conductive Silicone Paste，as the heat transfer medium of electronic components and lighting assemblies, use to reduce operating temperature of the heating element. REACH, ROHS certified High thermal conductivity Good temperature resistance