silicone potting material Manufacturers

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Hot Products

  • TS1008  High-Performance Thermal Paste 3.0W/mK for PC CPU Coolers & High Bay Light Cooling

    TS1008 High-Performance Thermal Paste 3.0W/mK for PC CPU Coolers & High Bay Light Cooling

    3.0W/mK thermal paste: top-tier cooling for PC CPU coolers & high bay lights. It handles intense heat, fills micro-gaps completely, and boosts heatsink performance. Ideal for overclockers or commercial lighting setups.
  • SMT Red Adhesive Glue for Stencil Printing Heat Curing

    SMT Red Adhesive Glue for Stencil Printing Heat Curing

    SMT Red Adhesive Glue for Stencil Printing Heat Curing Features & Benefits Tensan SMT red glue is a one-component epoxy adhesive, curing at high temperature. It is designed for SMD components on printed circuit board bonding. 4109A has suitable for high-speed SMT placement machine Dispensing and stencil printing. It is of high adhesive strength after curing . REACH, ROHS, certified Excellent thixotropy Good adhesive strength after curing Easy to mix and use
  • TS1101 Flagship-Grade Thermal Paste (Customizable) 4.5W/mK for Laptop CPU & GPU Heavy-Duty Cooling

    TS1101 Flagship-Grade Thermal Paste (Customizable) 4.5W/mK for Laptop CPU & GPU Heavy-Duty Cooling

    4.5W/mK flagship thermal paste: customizable for laptop CPU/GPU heavy-duty cooling. It’s engineered for intense operation, can be adjusted to fit your device, and delivers industry-leading heat transfer. A premium choice.
  • TS5506 Pro-Grade Black RTV Adhesive for Power Modules & Heat Sinks , Extreme Temp Range (-40°C to 200°C)

    TS5506 Pro-Grade Black RTV Adhesive for Power Modules & Heat Sinks , Extreme Temp Range (-40°C to 200°C)

    Securing high-power electronics demands toughness. Our pro-grade black RTV adhesive is built for power modules, heat sinks, and transformers. Achieve UL94 V-0 flame retardancy for critical safety, withstand extreme temperatures from -40°C to 200°C, and provides robust mechanical fixation.
  • TS1003 High-Efficiency Thermal Paste (Easy to Apply)  2.0W/mK for GPU & PCB Board Cooling

    TS1003 High-Efficiency Thermal Paste (Easy to Apply) 2.0W/mK for GPU & PCB Board Cooling

    Our 2.0W/mK thermal paste is easy to apply—perfect for GPUs & PCB boards. It has a smooth, non-runny texture, fills micro-gaps quickly, and boosts heat transfer for mid-range components. Ideal for DIY builds or professional maintenance.
  • Low-Ag Low-Void No-Clean Solder Paste

    Low-Ag Low-Void No-Clean Solder Paste

    TENSAN TS-506 is a lead-free, no-clean solder paste formulated with Sn98.5Ag1.0Cu0.5 (low-silver SAC) alloy. Designed for cost-sensitive SMT applications, it delivers excellent wetting performance, low voiding rates, and stable printability across fine-pitch assemblies. TS-506 offers a broad reflow window and leaves minimal residue, making it a reliable choice for consumer electronics, automotive modules, and industrial controls where both quality and cost efficiency matter.

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